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<p>This study proposes a digital light processing (DLP)-based method for fabricating high-entropy alloy (HEA) components with improved dimensional precision and reduced thermal stress. Gas-atomized AlCrFeNi powders are combined with photocurable resin, and the effects of polyfunctional monomer content, solid loading, and layer thickness on curing behavior, adhesion, and sintering shrinkage are systematically investigated. The optimal slurry formulation consists of 30 wt% TMPTA, 60 wt% 7201&#xa0;M, and 10 wt% TPO, achieving the highest adhesion. A layer thickness of half the cure depth ensures strong interlayer bonding with minimal deformation. Increasing solid content reduces sintering shrinkage but also limits light penetration, causing over-curing at high exposure energy. To address this, software-based dimensional correction is applied, reducing deformation from 5.45% to 0.8% at 60 vol% solid loading. Successful fabrication of 100&#xa0;μm and 200&#xa0;μm features further demonstrates the process resolution. Importantly, this study highlights the novelty of applying DLP technology to high-density metallic powders, where challenges such as insufficient curing depth due to strong light absorption and rapid powder sedimentation were effectively mitigated through optimized slurry formulation. These advancements establish DLP as a viable alternative to selective laser melting for metal additive manufacturing, enabling the production of customized, high-precision components while expanding the applicability of photopolymer-based approaches to metals.</p>

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Optimizing the DLP 3D printing process for alcrfeni high entropy alloy fabrication through parameters adjustment

  • 期刊论文

  • 发表日期：

    2025年11月12日

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  • Jui-Ting Liang,
  • You-Cheng Cheng

摘要

This study proposes a digital light processing (DLP)-based method for fabricating high-entropy alloy (HEA) components with improved dimensional precision and reduced thermal stress. Gas-atomized AlCrFeNi powders are combined with photocurable resin, and the effects of polyfunctional monomer content, solid loading, and layer thickness on curing behavior, adhesion, and sintering shrinkage are systematically investigated. The optimal slurry formulation consists of 30 wt% TMPTA, 60 wt% 7201 M, and 10 wt% TPO, achieving the highest adhesion. A layer thickness of half the cure depth ensures strong interlayer bonding with minimal deformation. Increasing solid content reduces sintering shrinkage but also limits light penetration, causing over-curing at high exposure energy. To address this, software-based dimensional correction is applied, reducing deformation from 5.45% to 0.8% at 60 vol% solid loading. Successful fabrication of 100 μm and 200 μm features further demonstrates the process resolution. Importantly, this study highlights the novelty of applying DLP technology to high-density metallic powders, where challenges such as insufficient curing depth due to strong light absorption and rapid powder sedimentation were effectively mitigated through optimized slurry formulation. These advancements establish DLP as a viable alternative to selective laser melting for metal additive manufacturing, enabling the production of customized, high-precision components while expanding the applicability of photopolymer-based approaches to metals.