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<p>Conventional metal-based heat sinks are increasingly inadequate for meeting the heat dissipation requirements of high-power electronic devices. The phase-change-based heat sinks (PCHS) have shown promising capability in thermal management, but their limited thermal stability, poor processability, and low thermal conductivity set huge obstacles for fabricating high-performance PCHS via previous strategies. Here, paraffin wax (PW) is confined in a flexible polymer matrix by a facile melt blending. Additionally, modified boron nitride (mBN) was uniformly dispersed within the composite to create a composite phase change materials (PCMs) with exceptional thermal stability, high latent heat storage density, elevated thermal conductivity, and favorable 3D printability. Then, fused jet deposition 3D printing was utilized to directly manufacture high-performance PCHS. Remarkably, when serving as a practical heat sink, the novel PCHS can achieve a cooling effect of more than 50&#xa0;°C. The heat sinks fabricated using this composite PCMs, which possesses excellent comprehensive capabilities, exhibit remarkable heat dissipation effects and can effectively address the heat dissipation challenges in next-generation electronic devices.</p>

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3D printing phase-change-based heat sinks for cooling electronic devices

  • 期刊论文

  • 发表日期：

    2025年8月23日

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  • Fang Wei,
  • Gong-Peng Cui,
  • Kai-Yin Sun,
  • Hong-Bo Lan,
  • Chao-Xu Li,
  • Chang-Ping Feng,
  • Li-Bo Chen,
  • Wei Yang

摘要

Conventional metal-based heat sinks are increasingly inadequate for meeting the heat dissipation requirements of high-power electronic devices. The phase-change-based heat sinks (PCHS) have shown promising capability in thermal management, but their limited thermal stability, poor processability, and low thermal conductivity set huge obstacles for fabricating high-performance PCHS via previous strategies. Here, paraffin wax (PW) is confined in a flexible polymer matrix by a facile melt blending. Additionally, modified boron nitride (mBN) was uniformly dispersed within the composite to create a composite phase change materials (PCMs) with exceptional thermal stability, high latent heat storage density, elevated thermal conductivity, and favorable 3D printability. Then, fused jet deposition 3D printing was utilized to directly manufacture high-performance PCHS. Remarkably, when serving as a practical heat sink, the novel PCHS can achieve a cooling effect of more than 50 °C. The heat sinks fabricated using this composite PCMs, which possesses excellent comprehensive capabilities, exhibit remarkable heat dissipation effects and can effectively address the heat dissipation challenges in next-generation electronic devices.