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<p>The introduction of TiC particles promotes the re-dissolution of more Cu atoms into the Al matrix. EPMA analysis shows that the distribution of Cu elements in the Al matrix of the TiC/2319 composite is more uniform. This study focuses on the 1.3&#xa0;wt.% TiC particle-reinforced 2319 aluminum matrix composite fabricated by semi-continuous casting, systematically investigating the influence of TiC addition on the microstructure and properties of the composite, with an emphasis on elucidating the mechanism of TiC particles on the diffusion behavior of Cu atoms during the homogenization process. Optical microscopy, scanning electron microscopy, electron probe microanalysis, hardness testing, electrical conductivity testing, and friction-wear tests were employed to characterize the microstructure, elemental distribution, and comprehensive properties of the composite. The results indicate that the addition of 1.3&#xa0;wt.% TiC increases the as-cast hardness of the composite from 64.42 HV for the matrix alloy to 70.68 HV, representing an improvement of approximately 10%, while the friction-wear rate is reduced by about 27% and the electrical conductivity decreases by approximately 1.5%. After homogenization treatment (540&#xa0;°C/20 h), the residual phases in both the TiC/2319 composite and the matrix alloy are primarily intermetallic compounds containing Al, Cu, and Fe, with minor amounts of Mn, Ti, V, and Zr distributed in the matrix. Microstructural analysis reveals that the introduction of TiC particles induces lattice distortion in the Al matrix and increases the vacancy concentration, thereby significantly promoting the diffusion kinetics of Cu atoms. Electron probe microanalysis results demonstrate that after homogenization treatment, the distribution uniformity of Cu elements in the Al matrix of the TiC/2319 composite is significantly better than that of the unreinforced 2319 aluminum alloy. This study reveals a novel mechanism by which TiC particles enhance atomic diffusion to achieve microstructural homogenization during the homogenization process, providing theoretical and experimental foundations for the synergistic optimization of high-strength and high-conductivity aluminum matrix composites for aerospace structural applications.</p>

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Influence of TiC Particles on Microstructure, Properties, and Cu Diffusion in TiC/2319 Composites

  • 期刊论文

  • 发表日期：

    2026年6月22日

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  • Gaosong Wang,
  • Fuhao Liu,
  • Yongsheng Miao,
  • Yuxin Jin,
  • Tao Zheng,
  • Shengxiao Zhou

摘要

The introduction of TiC particles promotes the re-dissolution of more Cu atoms into the Al matrix. EPMA analysis shows that the distribution of Cu elements in the Al matrix of the TiC/2319 composite is more uniform. This study focuses on the 1.3 wt.% TiC particle-reinforced 2319 aluminum matrix composite fabricated by semi-continuous casting, systematically investigating the influence of TiC addition on the microstructure and properties of the composite, with an emphasis on elucidating the mechanism of TiC particles on the diffusion behavior of Cu atoms during the homogenization process. Optical microscopy, scanning electron microscopy, electron probe microanalysis, hardness testing, electrical conductivity testing, and friction-wear tests were employed to characterize the microstructure, elemental distribution, and comprehensive properties of the composite. The results indicate that the addition of 1.3 wt.% TiC increases the as-cast hardness of the composite from 64.42 HV for the matrix alloy to 70.68 HV, representing an improvement of approximately 10%, while the friction-wear rate is reduced by about 27% and the electrical conductivity decreases by approximately 1.5%. After homogenization treatment (540 °C/20 h), the residual phases in both the TiC/2319 composite and the matrix alloy are primarily intermetallic compounds containing Al, Cu, and Fe, with minor amounts of Mn, Ti, V, and Zr distributed in the matrix. Microstructural analysis reveals that the introduction of TiC particles induces lattice distortion in the Al matrix and increases the vacancy concentration, thereby significantly promoting the diffusion kinetics of Cu atoms. Electron probe microanalysis results demonstrate that after homogenization treatment, the distribution uniformity of Cu elements in the Al matrix of the TiC/2319 composite is significantly better than that of the unreinforced 2319 aluminum alloy. This study reveals a novel mechanism by which TiC particles enhance atomic diffusion to achieve microstructural homogenization during the homogenization process, providing theoretical and experimental foundations for the synergistic optimization of high-strength and high-conductivity aluminum matrix composites for aerospace structural applications.