Scholarlink

<p>Stretchable electronics have attracted significant attention owing to their unique mechanical flexibility, promising performance, and wear comfort. However, the reliance on single-layer architectures restricts their integration density, and mechanical incompatibility between rigid components and soft substrates limits their service life. To address these challenges, we developed a LEGO-like modular assembly strategy for constructing multilayer three-dimensional (3D) stretchable electronics. In this approach, electronic components (ECs) and self-healing polyurethane (SPU) substrates patterned with liquid metal (LM) circuits function as the LEGO blocks. This modular assembly design simplifies fabrication and enhances the 3D integration density. In addition, the combination of liquid metal circuits and self-healing elastic substrates allows the devices to withstand diverse deformation conditions and facilitates autonomous healing after mechanical damage. Notably, the fabricated devices can undergo multiple recycling and reuse cycles. The design concept and methodology presented here propose a new approach for developing advanced flexible electronics.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

LEGO-like three-dimensional integrated stretchable electronics

  • 期刊论文

  • 发表日期：

    2025年11月25日

查看全文
  • Qingyu Wang,
  • Xiaoying Yang,
  • Zijuan Hu,
  • Yajun Li,
  • Xuanming Zhang,
  • Bingqian Liu,
  • Pengkun Yang,
  • Lu Huang,
  • Yingpeng Wu

摘要

Stretchable electronics have attracted significant attention owing to their unique mechanical flexibility, promising performance, and wear comfort. However, the reliance on single-layer architectures restricts their integration density, and mechanical incompatibility between rigid components and soft substrates limits their service life. To address these challenges, we developed a LEGO-like modular assembly strategy for constructing multilayer three-dimensional (3D) stretchable electronics. In this approach, electronic components (ECs) and self-healing polyurethane (SPU) substrates patterned with liquid metal (LM) circuits function as the LEGO blocks. This modular assembly design simplifies fabrication and enhances the 3D integration density. In addition, the combination of liquid metal circuits and self-healing elastic substrates allows the devices to withstand diverse deformation conditions and facilitates autonomous healing after mechanical damage. Notably, the fabricated devices can undergo multiple recycling and reuse cycles. The design concept and methodology presented here propose a new approach for developing advanced flexible electronics.