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<p>To adapt to the trend of increasing miniaturization and high integration of microelectronic equipments, there is a high demand for multifunctional thermally conductive (TC) polymeric films combining excellent flame retardancy and low dielectric constant (<i>ε</i>). To date, there have been few successes that achieve such a performance portfolio in polymer films due to their different and even mutually exclusive governing mechanisms. Herein, we propose a trinity strategy for creating a rationally engineered heterostructure nanoadditive (FG@CuP@ZTC) by in situ self-assembly immobilization of copper-phenyl phosphonate (CuP) and zinc-3, 5-diamino-1,2,4-triazole complex (ZTC) onto the fluorinated graphene (FG) surface. Benefiting from the synergistic effects of FG, CuP, and ZTC and the bionic lay-by-lay (LBL) strategy, the as-fabricated waterborne polyurethane (WPU) nanocomposite film with 30 wt% FG@CuP@ZTC exhibits a 55.6% improvement in limiting oxygen index (LOI), 66.0% and 40.5% reductions in peak heat release rate and total heat release, respectively, and 93.3% increase in tensile strength relative to pure WPU film due to the synergistic effects between FG, CuP, and ZTC. Moreover, the WPU nanocomposite film presents a high thermal conductivity (<i>λ</i>) of 12.7 W m<sup>−1</sup>&#xa0;K<sup>−1</sup> and a low <i>ε</i> of 2.92 at 10<sup>6</sup>&#xa0;Hz. This work provides a commercially viable rational design strategy to develop high-performance multifunctional polymer nanocomposite films, which hold great potential as advanced polymeric thermal dissipators for high-power-density microelectronics.</p>

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An Engineered Heterostructured Trinity Enables Fire-Safe, Thermally Conductive Polymer Nanocomposite Films with Low Dielectric Loss

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年2月26日

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  • Qiang Chen,
  • Jiabing Feng,
  • Yijiao Xue,
  • Siqi Huo,
  • Toan Dinh,
  • Hang Xu,
  • Yongqian Shi,
  • Jiefeng Gao,
  • Long-Cheng Tang,
  • Guobo Huang,
  • Weiwei Lei,
  • Pingan Song

摘要

To adapt to the trend of increasing miniaturization and high integration of microelectronic equipments, there is a high demand for multifunctional thermally conductive (TC) polymeric films combining excellent flame retardancy and low dielectric constant (ε). To date, there have been few successes that achieve such a performance portfolio in polymer films due to their different and even mutually exclusive governing mechanisms. Herein, we propose a trinity strategy for creating a rationally engineered heterostructure nanoadditive (FG@CuP@ZTC) by in situ self-assembly immobilization of copper-phenyl phosphonate (CuP) and zinc-3, 5-diamino-1,2,4-triazole complex (ZTC) onto the fluorinated graphene (FG) surface. Benefiting from the synergistic effects of FG, CuP, and ZTC and the bionic lay-by-lay (LBL) strategy, the as-fabricated waterborne polyurethane (WPU) nanocomposite film with 30 wt% FG@CuP@ZTC exhibits a 55.6% improvement in limiting oxygen index (LOI), 66.0% and 40.5% reductions in peak heat release rate and total heat release, respectively, and 93.3% increase in tensile strength relative to pure WPU film due to the synergistic effects between FG, CuP, and ZTC. Moreover, the WPU nanocomposite film presents a high thermal conductivity (λ) of 12.7 W m−1 K−1 and a low ε of 2.92 at 106 Hz. This work provides a commercially viable rational design strategy to develop high-performance multifunctional polymer nanocomposite films, which hold great potential as advanced polymeric thermal dissipators for high-power-density microelectronics.