<p>The production and study of a novel heat-resistant and hydrophobic nanocomposite, CuFe₂O₄@silicone resin, revealed that the Si–O–Ph bonds formed by the interaction of Si–OH groups increased the degree of cross-linking of the resin during the curing process. The cured resin demonstrated remarkable thermal and thermo-oxidative stability, significantly surpassing conventional methyl-phenyl silicone resin, according to thermogravimetric analysis (TGA). The primary reason for this notable improvement in thermal stability was the Si–O–Ph bonds, which increased the degree of cross-linking and successfully stopped degradation and hydrophobicity by oxidative cleavage and "back-biting." At 700&#xa0;°C, nearly 60% of the produced nanocomposite remained intact after full curing without breaking down. The significant amount of char produced by this resin indicates that it can be used in coating, anticorrosion, and high-performance flame-retardant and ablation-resistant products. The hydrophobicity of the CuFe₂O₄@silicone resin was assessed using the Water Contact Angle (WCA). In addition, CuFe₂O₄ and CuFe₂O₄@silicone resin were characterized by FT-IR, XRD, EDX, VSM, FESEM, TEM, and TGA. The impact of these variables on the coating qualities of CuFe₂O₄@silicone resin and the coating's anticorrosion performance was then examined. The results demonstrated that the ideal CuFe₂O₄ combined with silicone resin had a hydrophobicity that was extremely high in terms of anticorrosivity. Additionally, the coating's heat resistance was extremely good.</p> Graphical Abstract <p></p>