Design and composite control of a vibration-assisted device for polishing with piezoelectric drive
摘要
Silicon carbide (SiC) ceramics are widely used due to their excellent properties; however, their poor machinability limits the achievement of high surface quality. To enable high-quality precision machining of SiC, this study develops a novel vibration-assisted device (VAD) featuring a large stroke, fast response, and strong decoupling capability. To simulate the hysteresis characteristics of the VAD, a Hammerstein structure is adopted, integrating a non-symmetric Bouc-Wen (BW) hysteresis model with a linear dynamic model, and model parameters are identified using the Artificial Hummingbird Algorithm (AHA). To realize the high accuracy tracking of the VAD, a disturbance observer–proportional–integral–derivative (DOB–PID) composite controller is designed: the introduction of an inverse non-symmetric BW model as a feedforward compensator effectively enhances system linearity, while the combined action of the DOB and PID feedback control ensures high-precision trajectory tracking. Experimental results show that after vibration-assisted polishing with the proposed VAD, the surface roughness of SiC ceramics is significantly reduced from approximately 22 nm after initial mechanical grinding to 9 nm. This improvement is attributed to the high-precision vibration-assisted polishing process, providing an effective technical solution and a novel approach for precision surface machining of hard and brittle materials.
Graphical abstract