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<p>With global environmental regulations strictly restricting Sn-Pb solders, developing high-performance lead-free solders has become a critical challenge for ensuring electronic device reliability and advancing green manufacturing. Driven by rapid technological progress in the global electronics and information industry, performance requirements have increasingly shifted toward reliability under extreme operating conditions. However, conventional lead-free solders are often plagued by excessively coarse primary crystals and overdeveloped intermetallic compound (IMC) layers. This paper reviews recent advancements in modifying traditional lead-free solders, including Sn-Cu, Sn-Zn, Sn-Bi, and Sn-Ag-Cu systems, and provides an in-depth analysis of the mechanisms underlying composite modification via trace element alloying and nanoparticle doping. Trace element alloying regulates the microstructure through solid solution strengthening and second-phase strengthening, while nanoparticle doping provides heterogeneous nucleation sites to refine grains and inhibit IMC growth. Furthermore, this study proposes the introduction of magnetic field-assisted regulation. By utilizing a uniform magnetic field to suppress particle agglomeration and guide grain orientation at the kinetic level, defects such as coarse second-phase precipitates and nanoparticle clustering are effectively mitigated. The synergistic integration of external field assistance and compositional design compensates for the inherent limitations of alloying and doping alone. This approach transcends traditional additive modification, offering new perspectives for the development of next-generation electronic packaging materials.</p>

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Current status of research on the modification of Sn-based lead-free solder: a review

  • 期刊论文

  • 发表日期：

    2026年7月27日

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  • Qinrong Sun,
  • Xuehai Liao,
  • Jing Zhang,
  • Jinhong Dai,
  • Wei Feng,
  • Long Zhang,
  • Limeng Yin

摘要

With global environmental regulations strictly restricting Sn-Pb solders, developing high-performance lead-free solders has become a critical challenge for ensuring electronic device reliability and advancing green manufacturing. Driven by rapid technological progress in the global electronics and information industry, performance requirements have increasingly shifted toward reliability under extreme operating conditions. However, conventional lead-free solders are often plagued by excessively coarse primary crystals and overdeveloped intermetallic compound (IMC) layers. This paper reviews recent advancements in modifying traditional lead-free solders, including Sn-Cu, Sn-Zn, Sn-Bi, and Sn-Ag-Cu systems, and provides an in-depth analysis of the mechanisms underlying composite modification via trace element alloying and nanoparticle doping. Trace element alloying regulates the microstructure through solid solution strengthening and second-phase strengthening, while nanoparticle doping provides heterogeneous nucleation sites to refine grains and inhibit IMC growth. Furthermore, this study proposes the introduction of magnetic field-assisted regulation. By utilizing a uniform magnetic field to suppress particle agglomeration and guide grain orientation at the kinetic level, defects such as coarse second-phase precipitates and nanoparticle clustering are effectively mitigated. The synergistic integration of external field assistance and compositional design compensates for the inherent limitations of alloying and doping alone. This approach transcends traditional additive modification, offering new perspectives for the development of next-generation electronic packaging materials.