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<p>This paper systematically investigates the impact of nickel-coated carbon nanotubes (Ni-CNTs) on the melting behavior, wettability, microstructure, properties, and fracture characteristics of SnBiIn-based low-temperature solder. The growth kinetics of interfacial intermetallic compounds (IMCs) at SnBiIn-<i>x</i>(Ni-CNTs)/Cu solder joints were also examined. Results show that Ni-CNTs have little effect on the melting point of SnBiIn solder. All solders melt at about 80&#xa0;°C. As the Ni-CNTs content increases, the solder wettability initially decreases and subsequently increases, achieving optimal performance at a content of 0.075 wt.%. At this time, the wetting angle is 29.8° and the spreading area is 79.0 mm<sup>2</sup>. The Ni-CNTs addition results in significant refinement of the solder microstructure. The minimum average width of the InBi phase, measuring (3.97 ± 1.56) μm, was achieved at a Ni-CNTs content of 0.05 wt.%. With further increases in Ni-CNT concentration, coarsening of the InBi phase occurred. Correspondingly, the tensile strength of the solder exhibited an initial increase followed by a decrease, reaching its maximum value of 66.52 MPa at the optimal Ni-CNTs addition level of 0.05 wt.%. At the solder joint interface, the intermetallic compounds (IMCs) were identified to be composed primarily of Cu<sub>6</sub>(Sn,In)₅ and Cu₃(Sn,In) phases. Ni-CNTs addition reduces the formation of prismatic Cu₆(Sn,In)₅ phases, while increasing the generation of scallop-shaped phases. Interfacial IMCs thickness exhibits a minimum value (2.49 μm) at 0.075 wt.% Ni-CNTs.</p>

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Enhancing properties, microstructure and interfacial reaction of SnBiIn solder with nickel-coated carbon nanotubes

  • 期刊论文

  • 发表日期：

    2026年6月25日

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  • Zheng Liu,
  • Yang Zheng,
  • Yucong He,
  • Yu Zhang,
  • Yaocheng Zhang,
  • Qixing Liu,
  • Li Yang

摘要

This paper systematically investigates the impact of nickel-coated carbon nanotubes (Ni-CNTs) on the melting behavior, wettability, microstructure, properties, and fracture characteristics of SnBiIn-based low-temperature solder. The growth kinetics of interfacial intermetallic compounds (IMCs) at SnBiIn-x(Ni-CNTs)/Cu solder joints were also examined. Results show that Ni-CNTs have little effect on the melting point of SnBiIn solder. All solders melt at about 80 °C. As the Ni-CNTs content increases, the solder wettability initially decreases and subsequently increases, achieving optimal performance at a content of 0.075 wt.%. At this time, the wetting angle is 29.8° and the spreading area is 79.0 mm2. The Ni-CNTs addition results in significant refinement of the solder microstructure. The minimum average width of the InBi phase, measuring (3.97 ± 1.56) μm, was achieved at a Ni-CNTs content of 0.05 wt.%. With further increases in Ni-CNT concentration, coarsening of the InBi phase occurred. Correspondingly, the tensile strength of the solder exhibited an initial increase followed by a decrease, reaching its maximum value of 66.52 MPa at the optimal Ni-CNTs addition level of 0.05 wt.%. At the solder joint interface, the intermetallic compounds (IMCs) were identified to be composed primarily of Cu6(Sn,In)₅ and Cu₃(Sn,In) phases. Ni-CNTs addition reduces the formation of prismatic Cu₆(Sn,In)₅ phases, while increasing the generation of scallop-shaped phases. Interfacial IMCs thickness exhibits a minimum value (2.49 μm) at 0.075 wt.% Ni-CNTs.