<p>The finite element method (FEM) is employed to simulate crack propagation within the adhesive layer of bonded composite repairs for cracked aircraft structures. Due to its relatively low mechanical properties, the adhesive represents the weakest element of the plate–adhesive–patch assembly and is therefore the most prone to damage. FEM is used to predict, through stress intensity factors (SIFs), the adhesive regions predisposed to debonding and the interfaces where this damage initiates. Since the adhesive is loaded only through forces transferred from the cracked plate to the patch, its behavior is governed by the stress distribution in these two components. The results show that the propagation modes and kinetics of adhesive crack fronts depend on the interface type, the position of the fronts relative to the repaired plate crack, and the local stress field within the adhesive. Depending on these factors, the cracks propagate in mode I, mode II, or mixed mode. The analysis highlights adhesive and interfacial zones exhibiting high instability, particularly near the plate-crack opening and the patch edge. These highly stressed regions are preferential sites for debond initiation. The elevated SIF values indicate that debonding develops progressively from one edge to the other, mainly along the plate–adhesive interface, where delamination occurs frequently. An XFEM–CZM coupled approach is used to simulate crack propagation in the plate and damage evolution in the adhesive. The results confirm that debonding initiates at the aforementioned edges and propagates across the bondline, reducing the stiffness of the repaired structure.</p>

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Advancing aircraft repair analysis: interaction effects between plate damage and adhesive degradation

  • Imene Lariche,
  • Mohammed Amine Bellali,
  • Boualem Serier,
  • Bel Abbes Bachir Bouiadjra,
  • Raul D. S. G. Campilho

摘要

The finite element method (FEM) is employed to simulate crack propagation within the adhesive layer of bonded composite repairs for cracked aircraft structures. Due to its relatively low mechanical properties, the adhesive represents the weakest element of the plate–adhesive–patch assembly and is therefore the most prone to damage. FEM is used to predict, through stress intensity factors (SIFs), the adhesive regions predisposed to debonding and the interfaces where this damage initiates. Since the adhesive is loaded only through forces transferred from the cracked plate to the patch, its behavior is governed by the stress distribution in these two components. The results show that the propagation modes and kinetics of adhesive crack fronts depend on the interface type, the position of the fronts relative to the repaired plate crack, and the local stress field within the adhesive. Depending on these factors, the cracks propagate in mode I, mode II, or mixed mode. The analysis highlights adhesive and interfacial zones exhibiting high instability, particularly near the plate-crack opening and the patch edge. These highly stressed regions are preferential sites for debond initiation. The elevated SIF values indicate that debonding develops progressively from one edge to the other, mainly along the plate–adhesive interface, where delamination occurs frequently. An XFEM–CZM coupled approach is used to simulate crack propagation in the plate and damage evolution in the adhesive. The results confirm that debonding initiates at the aforementioned edges and propagates across the bondline, reducing the stiffness of the repaired structure.