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<p>Microstamping is a critical process in the fabrication of precision microdevices, and C7701/Ti/C7701 ultra-thin composite foils are considered ideal materials due to their outstanding comprehensive properties. This study systematically investigates the effects of different annealing temperatures (500–700&#xa0;°C) on the interfacial characteristics and microstamping performance of this composite material. Through microstructural observation, EDS analysis, XRD phase identification, and microstamping experiments, it was found that as the annealing temperature increases, the grain size gradually increases (from 6.36&#xa0;μm at 500&#xa0;°C to 24.11&#xa0;μm at 700&#xa0;°C), and the interfacial diffusion layer thickness progressively thickens (from 2.1 to 10.1&#xa0;μm), eventually forming a multi-gradient and multilayer structure accompanied by the formation of numerous intermetallic compounds (mainly Ti<sub>2</sub>Ni and Ti<sub>2</sub>Cu). Composite foils annealed at 500–600&#xa0;°C exhibit excellent microstamping formability. However, annealing above 650&#xa0;°C leads to significant thickening and continuous distribution of brittle intermetallic layers, resulting in brittle fracture at the bottom of stamped parts and a sharp decline in formability. This study provides important theoretical guidance for optimizing the microstructure and microstamping formability of multilayer composite metal foils.</p>

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Effect of annealing temperature on interfacial characteristics and microstamping performance of C7701/Ti/C7701 ultra-thin composite foil

  • 期刊论文

  • 发表日期：

    2026年3月22日

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  • Rui Chen,
  • Zhihe Dou,
  • Hongmei Zhang,
  • Tingan Zhang

摘要

Microstamping is a critical process in the fabrication of precision microdevices, and C7701/Ti/C7701 ultra-thin composite foils are considered ideal materials due to their outstanding comprehensive properties. This study systematically investigates the effects of different annealing temperatures (500–700 °C) on the interfacial characteristics and microstamping performance of this composite material. Through microstructural observation, EDS analysis, XRD phase identification, and microstamping experiments, it was found that as the annealing temperature increases, the grain size gradually increases (from 6.36 μm at 500 °C to 24.11 μm at 700 °C), and the interfacial diffusion layer thickness progressively thickens (from 2.1 to 10.1 μm), eventually forming a multi-gradient and multilayer structure accompanied by the formation of numerous intermetallic compounds (mainly Ti2Ni and Ti2Cu). Composite foils annealed at 500–600 °C exhibit excellent microstamping formability. However, annealing above 650 °C leads to significant thickening and continuous distribution of brittle intermetallic layers, resulting in brittle fracture at the bottom of stamped parts and a sharp decline in formability. This study provides important theoretical guidance for optimizing the microstructure and microstamping formability of multilayer composite metal foils.