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<p>The solidification of high-entropy alloys CoCrFeNiCu<sub><i>x</i></sub> during welding was investigated. Alloys with the Cu mole ratio <i>x</i> ≈ 0, 0.5, 1, 1.5, and 2 were prepared and quenched during welding. The effect of <i>x</i> on the solidification microstructure was examined, including grain-boundary migration, ductility-dip cracking, and dendrites of the Cu-lean fcc phase Fcc1. The effect of <i>x</i> on the solidification microstructure evolution was explained with the help of an isopleth calculated between equimolar CoCrFeNi and pure Cu and the solidification paths of the alloys.</p>

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Effect of Cu on weld solidification microstructure of CoCrFeNiCux alloys

  • 期刊论文

  • 发表日期：

    2026年3月22日

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  • Ping Yu,
  • Chun-Ming Lin,
  • Sindo Kou

摘要

The solidification of high-entropy alloys CoCrFeNiCux during welding was investigated. Alloys with the Cu mole ratio x ≈ 0, 0.5, 1, 1.5, and 2 were prepared and quenched during welding. The effect of x on the solidification microstructure was examined, including grain-boundary migration, ductility-dip cracking, and dendrites of the Cu-lean fcc phase Fcc1. The effect of x on the solidification microstructure evolution was explained with the help of an isopleth calculated between equimolar CoCrFeNi and pure Cu and the solidification paths of the alloys.