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<p>The reliable joining of SiCp/Al composites to aluminum alloys faces challenges due to thermal expansion mismatch and interfacial reaction complexity. In this study, 55 vol.% SiCp/ZL102 composites and 6061 aluminum alloy were vacuum brazed using Zn–Al and Zn–Al–Sn filler metals. We examined how Al and Sn contents affect filler melting behavior, joint microstructure, and mechanical properties. Zn–Al fillers consisted mainly of η-Zn and α-Zn–Al solid solution phases, with Zn–10Al yielding the highest shear strength of 19.33&#xa0;MPa. Sn addition significantly reduced the filler melting temperature, lowering it by ~ 35&#xa0;°C at 12 wt.% Sn. Further analysis showed that moderate Sn improved wetting, whereas higher Sn contents promoted pore formation and segregation during solidification. The optimal Sn content of 6 wt.% resulted in the maximum shear strength of 22.19&#xa0;MPa, representing a 14.8% improvement compared with Zn–Al filler. Fractographic analysis indicated a predominantly brittle fracture mode with localized ductile dimples, contributing to enhanced joint toughness. These findings demonstrate that Zn–Al-based fillers can achieve reliable low-temperature bonding without external pressure, offering practical advantages for electronic packaging applications with strict thermal constraints. They also offer valuable insights for advanced electronic packaging applications.</p>

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Vacuum brazing of 55% SiCp/ZL102 composites and 6061 aluminum alloy using Zn–Al and Zn–Al–Sn filler metals

  • 期刊论文

  • 发表日期：

    2026年1月14日

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  • Dongfeng Cheng,
  • Yuxi Zhao,
  • Xiaoyu Hu,
  • Josip Brnic

摘要

The reliable joining of SiCp/Al composites to aluminum alloys faces challenges due to thermal expansion mismatch and interfacial reaction complexity. In this study, 55 vol.% SiCp/ZL102 composites and 6061 aluminum alloy were vacuum brazed using Zn–Al and Zn–Al–Sn filler metals. We examined how Al and Sn contents affect filler melting behavior, joint microstructure, and mechanical properties. Zn–Al fillers consisted mainly of η-Zn and α-Zn–Al solid solution phases, with Zn–10Al yielding the highest shear strength of 19.33 MPa. Sn addition significantly reduced the filler melting temperature, lowering it by ~ 35 °C at 12 wt.% Sn. Further analysis showed that moderate Sn improved wetting, whereas higher Sn contents promoted pore formation and segregation during solidification. The optimal Sn content of 6 wt.% resulted in the maximum shear strength of 22.19 MPa, representing a 14.8% improvement compared with Zn–Al filler. Fractographic analysis indicated a predominantly brittle fracture mode with localized ductile dimples, contributing to enhanced joint toughness. These findings demonstrate that Zn–Al-based fillers can achieve reliable low-temperature bonding without external pressure, offering practical advantages for electronic packaging applications with strict thermal constraints. They also offer valuable insights for advanced electronic packaging applications.