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<p>In this study, a new electroless nickel-plating process for Ni/Al<sub>2</sub>O<sub>3</sub> was investigated. The impacts of different Ni/Al<sub>2</sub>O<sub>3</sub> addition amounts on the shear strength of brazed joints between composite filler metal and copper substrate and on the growth of IMC layers at the interface were explored. Growth laws of Cu<sub>6</sub>Sn<sub>5</sub> and Cu₃Sn IMC layers at different aging temperatures were analyzed using relevant theories. Results show that after electroless plating, Ni coated on Ni/Al<sub>2</sub>O<sub>3</sub> with a semi-coherent interface. As Ni/Al<sub>2</sub>O<sub>3</sub> content increased, the shear strength of joints rose compared to the base filler metal. The IMC’s zigzag shape became regular. At 0.3wt.% doping, the interface was continuous and fan-shaped. After aging, Ni/Al<sub>2</sub>O<sub>3</sub> affected the growth of both IMC layers. Growth index and thickness changes of the layers with different addition amounts and temperatures were detailed. The diffusion coefficients of the two IMC layers first decreased and then slightly increased, and they had the maximum activation energy at 0.3wt.%.</p>

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Discussion on the influence law of Ni/Al2O3 particles on the growth of interfacial IMC in solder joints during soldering and aging processes

  • 期刊论文

  • 发表日期：

    2025年8月6日

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  • Bingying Wang,
  • Guohui Xu,
  • Junwei Zhao,
  • Yiming Hua,
  • Jingyi Feng,
  • Yifan Wang,
  • Huigai Wang

摘要

In this study, a new electroless nickel-plating process for Ni/Al2O3 was investigated. The impacts of different Ni/Al2O3 addition amounts on the shear strength of brazed joints between composite filler metal and copper substrate and on the growth of IMC layers at the interface were explored. Growth laws of Cu6Sn5 and Cu₃Sn IMC layers at different aging temperatures were analyzed using relevant theories. Results show that after electroless plating, Ni coated on Ni/Al2O3 with a semi-coherent interface. As Ni/Al2O3 content increased, the shear strength of joints rose compared to the base filler metal. The IMC’s zigzag shape became regular. At 0.3wt.% doping, the interface was continuous and fan-shaped. After aging, Ni/Al2O3 affected the growth of both IMC layers. Growth index and thickness changes of the layers with different addition amounts and temperatures were detailed. The diffusion coefficients of the two IMC layers first decreased and then slightly increased, and they had the maximum activation energy at 0.3wt.%.