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<p>In this paper, a SnBiIn solder alloy with a low-melting point was prepared. The effects of Ag particles on the wettability, thermal properties, microstructure, interfacial intermetallic compounds (IMCs) layer, and tensile properties of the SnBiIn solder alloy were investigated. The results show that the melting point of the SnBiIn alloy is about 85 ℃, and it is not changed by Ag particles. After adding Ag particles, the wettability of the solder alloy was improved, and 2.0 wt.% Ag particles could effectively reduce the average wetting angle from 43.9° to 35.0° and increase the spreading area from 53.6 to 68.1 mm<sup>2</sup>. The Ag<sub>2</sub>In IMC was formed in the microstructure, the microstructure of the solder alloy was refined, and the growth of interfacial IMC was inhibited. When the content of Ag is 3.0 wt.%, Bi-rich phase appears in the solder alloy, and the microstructure of the solder alloy is coarsened. The tensile strength of the SnBiIn solder alloy has also been improved, and 2.0 wt.% Ag particles can increase the tensile strength of the SnBiIn solder alloy from 41.71 to 58.90 MPa.</p>

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Microstructure and properties of SnBiIn low-melting point solder doped with Ag particles

  • 期刊论文

  • 发表日期：

    2025年2月10日

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  • Zheng Liu,
  • Haodong Wu,
  • Li Yang,
  • Yaocheng Zhang,
  • Yu Zhang,
  • Yucong He

摘要

In this paper, a SnBiIn solder alloy with a low-melting point was prepared. The effects of Ag particles on the wettability, thermal properties, microstructure, interfacial intermetallic compounds (IMCs) layer, and tensile properties of the SnBiIn solder alloy were investigated. The results show that the melting point of the SnBiIn alloy is about 85 ℃, and it is not changed by Ag particles. After adding Ag particles, the wettability of the solder alloy was improved, and 2.0 wt.% Ag particles could effectively reduce the average wetting angle from 43.9° to 35.0° and increase the spreading area from 53.6 to 68.1 mm2. The Ag2In IMC was formed in the microstructure, the microstructure of the solder alloy was refined, and the growth of interfacial IMC was inhibited. When the content of Ag is 3.0 wt.%, Bi-rich phase appears in the solder alloy, and the microstructure of the solder alloy is coarsened. The tensile strength of the SnBiIn solder alloy has also been improved, and 2.0 wt.% Ag particles can increase the tensile strength of the SnBiIn solder alloy from 41.71 to 58.90 MPa.