Abstract <p>Thermal management of microprocessors is considered a crucial factor in computer appliances. Several analyses and methods have been discussed regarding the heat sink and microprocessor scope. The shape, size, and material of the heat sink, as well as the velocity and direction of air from the CPU fan, play a crucial role in the thermal management of the microprocessor while the CPU is running. In this paper, a numerical and experimental analysis is done for the heat sink and microprocessor in order to understand the thermal response. Numerical analysis has been done to get the appropriate numerical outcomes, and an infrared thermographic study has been done as a part of the experimental analysis. Significant thermal differences have been observed under different conditions. Thermographic tools have proven valuable for obtaining detailed temperature distributions on these devices. Some important observations can be observed and discussed in detail in this article. CPU fan and position, shape, dimension of heat sink, and other related factors play an important role in dissipating heat away from the microprocessor. Heat gets dissipated from the microprocessor to the heat sink through conduction and further dissipated from the heat sink by convection. Finally, numerical and Experimental analyses have been done, which show small deviations.</p> Graphical Abstract <p></p>