<p>Thermal conductive epoxy-based materials (TCEMs) are urgently needed to the thermal management and vibration prevention of electronic devices, attributed to the rapid progress in integration and miniaturization of electronic components. Alumina oxide particles (Al₂O₃) are promising fillers because of its numerous advantages, including high thermal conductivity, high strength-to-weight ratio, desired fatigue resistance, and corrosion resistance. However, lack of precise models in the preparation process of TCEMs leads to low efficiency in stacking design for multi‑scale compound system. To address this issue, our research described in this paper fabricated an effective and continuous thermal transfer pathway for TCEMs by collecting the synergistic effects of ternary scale alumina oxide particles based on the Dinger–Funk stacking model. The effects of these selected fillers on the characteristics of TCEMs were further analyzed in terms of microscopic morphology, thermal conductivity (TC), rheological, mechanical and thermal stability. The experimental results show that a maximum TC (1.94&#xa0;W/(m⋅K)), excellent mechanical properties (the impact strength of 2.3&#xa0;kJ/m²), and good processing property (viscosity of 74&#xa0;Pa.s) of the as-prepared TCEMs4 was realized, owing to the effective and dense structure formed by different sizes fillers. According to the study, we denoted that combining different sizes Al₂O₃ fillers by employing the Dinger–Funk equation is a workable and broadly applicable way to obtain TCEMs composites that can be widely used for the efficient thermal management in practical applications.</p> Graphical abstract <p></p>