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<p>In the present research, the effect of post roll bonding annealing on the microstructural evolutions and mechanical properties in three-layered Cu/Ti/Cu composite investigated. The roll bonding was performed with a thickness reduction of 73%. Then, roll bonded Cu/Ti/Cu samples were subjected to post roll bonding annealing process at temperatures of 400 and 600&#xa0;°C for 2 hours. The results showed that by execution roll bonding with a 73% thickness reduction, good bonding between the layers was created, and a folded interface appeared due to the applied severe plastic deformation. Also, during post roll bonding annealing at 400&#xa0;°C, the Cu layer underwent static recrystallization, and the static recovery occurred in the Ti layer. It was also found that a reaction layer was formed due to the diffusion of Cu and Ti atoms in the interface during post roll bonding annealing at different temperatures. This reactive layer contains TiCu at 400 ℃ and two types of intermetallic compounds, TiCu and TiCu4, at 600&#xa0;°C. With increasing of annealing temperature, the thickness of the reactive layer increases from 0.66 at 400&#xa0;°C to 3.3 at 600&#xa0;°C. Also, by increasing the annealing temperatures from 400 to 600&#xa0;°C, the microhardness of the interface decreases from 144 to 136 Vickers. The maximum interface strength was obtained by post roll bonding annealing at 400&#xa0;°C for 2 hours, which was 65.2&#xa0;N/mm. With increasing the annealing temperature, the strength of the interface decreased owing to the increase in the thickness of the reactive layer. Annealing at 400&#xa0;°C caused the tensile strength of composites decreased by 30%, while the elongation improved by 34%.</p>

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Effect of Post Roll Bonding Annealing on the Microstructural Evolutions and Mechanical Properties of Three-Layered Cu/Ti/Cu Composite

  • 期刊论文

  • 发表日期：

    2025年5月19日

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  • R. Shafagh,
  • B. Eghbali,
  • M. Azarbarmas

摘要

In the present research, the effect of post roll bonding annealing on the microstructural evolutions and mechanical properties in three-layered Cu/Ti/Cu composite investigated. The roll bonding was performed with a thickness reduction of 73%. Then, roll bonded Cu/Ti/Cu samples were subjected to post roll bonding annealing process at temperatures of 400 and 600 °C for 2 hours. The results showed that by execution roll bonding with a 73% thickness reduction, good bonding between the layers was created, and a folded interface appeared due to the applied severe plastic deformation. Also, during post roll bonding annealing at 400 °C, the Cu layer underwent static recrystallization, and the static recovery occurred in the Ti layer. It was also found that a reaction layer was formed due to the diffusion of Cu and Ti atoms in the interface during post roll bonding annealing at different temperatures. This reactive layer contains TiCu at 400 ℃ and two types of intermetallic compounds, TiCu and TiCu4, at 600 °C. With increasing of annealing temperature, the thickness of the reactive layer increases from 0.66 at 400 °C to 3.3 at 600 °C. Also, by increasing the annealing temperatures from 400 to 600 °C, the microhardness of the interface decreases from 144 to 136 Vickers. The maximum interface strength was obtained by post roll bonding annealing at 400 °C for 2 hours, which was 65.2 N/mm. With increasing the annealing temperature, the strength of the interface decreased owing to the increase in the thickness of the reactive layer. Annealing at 400 °C caused the tensile strength of composites decreased by 30%, while the elongation improved by 34%.