<p>Friction Stir Processing (FSP) was employed on pure copper (Cu) at a fixed tool revolution rate of 900&#xa0;rpm and a varying traverse rate (50 to 200&#xa0;mm/min) with the aim of reducing the surface wear rate of the Cu. Following FSP, wear behavior, hardness, metallography, and electrical conductivity studied. The grain size of FSP-treated Cu decreased from 8 to 3&#xa0;<i>µ</i>m; while, FSP-treated Cu–graphene (Cu–Gr) composite showed a significant reduction in grain size from 2.1 to 1.5<i>&#xa0;µ</i>m. Comparative analysis revealed that the microhardness of FSP-treated copper and copper–graphene composite improved by approximately 45 and 71%, in comparison with pure Cu. The reduction in wear resistance was less pronounced for the FSP-treated Cu–Gr composite than for pure Cu and just FSP Cu. Both cases exhibited a marginal decrease in electrical conductivity 1.83% IACS. This research indicates that FSP has potential to enhance the surface tribological properties of copper without significantly compromising its electrical conductivity.</p>

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Comparative Study on the Wear Resistance of Friction Stir Processed Pure Copper and Copper–Graphene Composites

  • R. Bheekya Naik

摘要

Friction Stir Processing (FSP) was employed on pure copper (Cu) at a fixed tool revolution rate of 900 rpm and a varying traverse rate (50 to 200 mm/min) with the aim of reducing the surface wear rate of the Cu. Following FSP, wear behavior, hardness, metallography, and electrical conductivity studied. The grain size of FSP-treated Cu decreased from 8 to 3 µm; while, FSP-treated Cu–graphene (Cu–Gr) composite showed a significant reduction in grain size from 2.1 to 1.5 µm. Comparative analysis revealed that the microhardness of FSP-treated copper and copper–graphene composite improved by approximately 45 and 71%, in comparison with pure Cu. The reduction in wear resistance was less pronounced for the FSP-treated Cu–Gr composite than for pure Cu and just FSP Cu. Both cases exhibited a marginal decrease in electrical conductivity 1.83% IACS. This research indicates that FSP has potential to enhance the surface tribological properties of copper without significantly compromising its electrical conductivity.