<p>Two Cardo-based diamine derivatives containing ester and amide groups were synthesized and polymerized with BPDA to prepare polyimides. In the ester-containing polyimide, both oxygen atoms carry negative charges, effectively suppressing intramolecular charge transfer to reduce molecular polarization and dipole moments, resulting in a low-dielectric constant (2.85) and excellent optical properties (86% transmittance at 450&#xa0;nm). Conversely, the amide-containing polyimide forms intramolecular hydrogen bonds, exhibiting stronger intermolecular interactions that influence aggregation structures, delivering superior thermal stability with an ultralow coefficient of linear expansion (5.2&#xa0;ppm·K<sup>−1</sup>). However, the hydrogen and oxygen atoms in its structural units create complementary positive and negative charge centers, amplifying unit dipole moments and elevating the dielectric constant to 2.96. In addition, the hygroscopic nature of amide bonds increases water absorption to 3.7% due to interactions with polar water molecules. Both polyimides demonstrate robust mechanical performance, with tensile strengths exceeding 250&#xa0;MPa and elongation at break surpassing 20%. The ester-containing polyimide achieves an optimal balance of dielectric properties, thermal stability, and mechanical performance, positioning it as a promising candidate for high-frequency electronic applications.</p> Graphical Abstract <p></p>

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Synthesis and molecular simulation of low-dielectric cardo-based polyimides with amide- or ester-linked architectures

  • Jun Peng,
  • Wei Yang,
  • Yuhan Liu,
  • Xiaoqian Liu,
  • Jin Wang,
  • Jun Yang,
  • Haiyang Yang,
  • Anmin Huang

摘要

Two Cardo-based diamine derivatives containing ester and amide groups were synthesized and polymerized with BPDA to prepare polyimides. In the ester-containing polyimide, both oxygen atoms carry negative charges, effectively suppressing intramolecular charge transfer to reduce molecular polarization and dipole moments, resulting in a low-dielectric constant (2.85) and excellent optical properties (86% transmittance at 450 nm). Conversely, the amide-containing polyimide forms intramolecular hydrogen bonds, exhibiting stronger intermolecular interactions that influence aggregation structures, delivering superior thermal stability with an ultralow coefficient of linear expansion (5.2 ppm·K−1). However, the hydrogen and oxygen atoms in its structural units create complementary positive and negative charge centers, amplifying unit dipole moments and elevating the dielectric constant to 2.96. In addition, the hygroscopic nature of amide bonds increases water absorption to 3.7% due to interactions with polar water molecules. Both polyimides demonstrate robust mechanical performance, with tensile strengths exceeding 250 MPa and elongation at break surpassing 20%. The ester-containing polyimide achieves an optimal balance of dielectric properties, thermal stability, and mechanical performance, positioning it as a promising candidate for high-frequency electronic applications.

Graphical Abstract