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<p>Fine-grained AgNi alloys are attractive Ag-based conductive materials because of their high electrical conductivity, but their relatively low hardness in the annealed state remains a key limitation. This study investigates the effect of Sc microalloying on the microstructure, hardness, and electrical conductivity of AgNi alloys. Pure Ag, AgNi, and AgNiSc alloys were prepared by vacuum melting, rolling, annealing, and final heat treatment. Microstructural analysis shows that the addition of Ni refines the grain size from 26.28 to 10.02&#xa0;μm, while further addition of Sc reduces it to 8.92&#xa0;μm. TEM observations of the final processed AgNiSc alloy reveal high-density nanotwins with widths of approximately 5–50&#xa0;nm, together with stacking faults. These observations indicate that Sc microalloying promotes the formation and/or retention of faulted and nanotwinned structures in the final Ag matrix. The AgNiSc alloy exhibits a hardness of 64.3 HV, which is more than 30% higher than that of pure Ag and higher than that of the AgNi alloy (53.6 HV). This improvement is qualitatively attributed to the combined effects of grain boundary strengthening, solid-solution strengthening, and defect-related strengthening associated with stacking faults and nanotwins. The electrical conductivity decreases from 102.4 IACS for pure Ag to 90.9% IACS for AgNiSc, mainly due to enhanced electron scattering by solute atoms. These results demonstrate that Sc microalloying is a promising strategy for improving the hardness of fine-grained Ag-based alloys while maintaining relatively high electrical conductivity.</p>

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Promoting Nanotwin Formation for Strengthening in Fine-Grained AgNi Alloys via Sc Microalloying

  • 期刊论文

  • 发表日期：

    2026年7月25日

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  • Chunxin Wang,
  • Fengchuang Zhang,
  • Hesong Wang,
  • Feiyan Wei,
  • Jiayin Wang,
  • Jialiang Zhao,
  • Xin Qi,
  • Binchuan Li,
  • Xudong Luo,
  • Qing Han,
  • Pengcheng Man,
  • Qichao Liu

摘要

Fine-grained AgNi alloys are attractive Ag-based conductive materials because of their high electrical conductivity, but their relatively low hardness in the annealed state remains a key limitation. This study investigates the effect of Sc microalloying on the microstructure, hardness, and electrical conductivity of AgNi alloys. Pure Ag, AgNi, and AgNiSc alloys were prepared by vacuum melting, rolling, annealing, and final heat treatment. Microstructural analysis shows that the addition of Ni refines the grain size from 26.28 to 10.02 μm, while further addition of Sc reduces it to 8.92 μm. TEM observations of the final processed AgNiSc alloy reveal high-density nanotwins with widths of approximately 5–50 nm, together with stacking faults. These observations indicate that Sc microalloying promotes the formation and/or retention of faulted and nanotwinned structures in the final Ag matrix. The AgNiSc alloy exhibits a hardness of 64.3 HV, which is more than 30% higher than that of pure Ag and higher than that of the AgNi alloy (53.6 HV). This improvement is qualitatively attributed to the combined effects of grain boundary strengthening, solid-solution strengthening, and defect-related strengthening associated with stacking faults and nanotwins. The electrical conductivity decreases from 102.4 IACS for pure Ag to 90.9% IACS for AgNiSc, mainly due to enhanced electron scattering by solute atoms. These results demonstrate that Sc microalloying is a promising strategy for improving the hardness of fine-grained Ag-based alloys while maintaining relatively high electrical conductivity.