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<p>Aluminium silicon nitride (AlSiN or ASN for simplify) thin films were deposited on glass and steel substrates via a two-step method. Initially, AlSi layers with varying Si contents (7%, 10%, 13%, and 22%) were deposited using thermal evaporation. These films were then nitrided using Direct Current Plasma Nitriding (DCPN) with pure nitrogen gas to form ASN films. The structural, morphological, mechanical, tribological, and wettability properties were systematically characterized. X-ray diffraction (XRD) confirmed the presence of polycrystalline structures with dominant cubic AlN (c-AlN) phases, while Raman spectroscopy identified Si–N, E₂(high), and E₁(TO) vibrational modes. SEM and AFM analyses revealed smooth surfaces with increasing roughness (Ra) from 5.9&#xa0;nm to 28.18&#xa0;nm and a corresponding growth in grain size as the Si content increased. Mechanical testing showed a significant increase in hardness and Young’s modulus, reaching maximum values at 22% Si, despite a deviation from the classical Hall–Petch relationship. Tribological evaluation demonstrated a decrease in the friction coefficient with increasing silicon, reaching a minimum of 0.39 at 13% Si. Wettability measurements indicated a transition from hydrophilic to hydrophobic behavior, with contact angles increasing up to 106° for the 22% Si sample. These results demonstrate that AlSiN films exhibit excellent mechanical strength, low friction, and enhanced hydrophobicity, making them promising candidates for applications such as microfluidic systems, anti-fouling surfaces, and hydrogen embrittlement-resistant layers.</p>

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Influence of Si Content on the Structural, Mechanical, Tribological, and Wettability Properties of Al-Si–N Thin Films

  • 期刊论文

  • 发表日期：

    2026年2月5日

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  • Fouaz Lekoui,
  • Rachid Amrani,
  • Hiba Bechmoum,
  • Laid Henni,
  • Hanane Mechri,
  • Walid Filali,
  • Elyes Garoudja,
  • Mohamed Tahar Benabbas,
  • Slimane Oussalah,
  • Salim Hassani

摘要

Aluminium silicon nitride (AlSiN or ASN for simplify) thin films were deposited on glass and steel substrates via a two-step method. Initially, AlSi layers with varying Si contents (7%, 10%, 13%, and 22%) were deposited using thermal evaporation. These films were then nitrided using Direct Current Plasma Nitriding (DCPN) with pure nitrogen gas to form ASN films. The structural, morphological, mechanical, tribological, and wettability properties were systematically characterized. X-ray diffraction (XRD) confirmed the presence of polycrystalline structures with dominant cubic AlN (c-AlN) phases, while Raman spectroscopy identified Si–N, E₂(high), and E₁(TO) vibrational modes. SEM and AFM analyses revealed smooth surfaces with increasing roughness (Ra) from 5.9 nm to 28.18 nm and a corresponding growth in grain size as the Si content increased. Mechanical testing showed a significant increase in hardness and Young’s modulus, reaching maximum values at 22% Si, despite a deviation from the classical Hall–Petch relationship. Tribological evaluation demonstrated a decrease in the friction coefficient with increasing silicon, reaching a minimum of 0.39 at 13% Si. Wettability measurements indicated a transition from hydrophilic to hydrophobic behavior, with contact angles increasing up to 106° for the 22% Si sample. These results demonstrate that AlSiN films exhibit excellent mechanical strength, low friction, and enhanced hydrophobicity, making them promising candidates for applications such as microfluidic systems, anti-fouling surfaces, and hydrogen embrittlement-resistant layers.