Performance Investigation of Elevated Temperature Impacts on Stacked Oxide Triple Material Cylindrical Surrounding Gate Junctionless Tubular Channel MOSFET
摘要
Current research endeavor features the performance analysis of Stacked Oxide Triple Material Cylindrical Surrounding Gate Junctionless Tubular Channel MOSFET with emphasis on device response towards elevated temperatures and dimension miniaturization; 2D Poisson’s equation, considering the Young’s Parabolic Potential Approximation, has been solved to extract the expression of inner potential, which has been utilized to deduce the expression of threshold voltage; crucial device characteristics have been presented at heightened temperatures with comparative studies of those at 300 K temperature; illustrations of threshold voltage, subthreshold swing, drain current and associated parameters have been exhibited to highlight the improved performance of the proposed device which is further fortified by the evidences of comparative investigation with it’s Full-Channel Junctionless Equivalent. Benefits of stacked oxide system of HfO2/SiO2 in the proposed device have also been explored with relative analysis with other stacked oxide systems; Threshold voltage analysis and simulation confirms excellent corroboration and further strengthens the associated simulative investigation conducted in this research. The research study conducted exhibits the superior performance of the proposed device for its implementation in advanced applications.