<p>The manuscript conducts an extensive analysis of various spacer parameters on DC and analog characteristics of a novel Dopingless Nanosheet FET (DL-NSFET). The proposed study considers two types of spacers: single and dual spacers in symmetrical structure design. In a single spacer, Source/Drain side spacer are of the same kind of single-k dielectric material, and in a dual spacer, two vertically different-k spacer materials are used in the inner high-k configuration or in the inner low-k configuration. The effect of spacer materials having permittivity in the range of 1 to 22 and different spacer lengths in single and dual spacer configurations has been extensively studied in terms of analog and RF behavior. The high value of the drain current (2.39E-05 A), the high value of I<sub>on</sub>/I<sub>off</sub> ratio (2.39E + 09), lower SS (62.4&#xa0;mV/Dec), lower DIBL (23.01&#xa0;mV/V), higher g<sub>m</sub>, lower g<sub>ds</sub>, and higher gain is obtained with high-k (HfO<sub>2</sub>) spacer making it suitable for analog and digital applications. The capacitance profile of the device is also increased with dielectric permittivity, resulting in low f<sub>T</sub> and f<sub>max</sub>. In dual spacer design, HfO<sub>2</sub> as inner spacer gives better analog behavior in terms of better I<sub>off</sub>, I<sub>on</sub>/I<sub>off</sub>, SS and DIBL in comparison to SiO<sub>2</sub> as inner spacer material. Analog behavior of the device is improved with inner high-k spacer but RF behavior is better for inner low-k spacer.</p>

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Performance Analysis of Symmetrical Single and Dual Spacer Engineering On a Novel Dopingless Nanosheet Field-effect Transistor (DL-NSFET)

  • Abhishek Chauhan,
  • Ashish Raman

摘要

The manuscript conducts an extensive analysis of various spacer parameters on DC and analog characteristics of a novel Dopingless Nanosheet FET (DL-NSFET). The proposed study considers two types of spacers: single and dual spacers in symmetrical structure design. In a single spacer, Source/Drain side spacer are of the same kind of single-k dielectric material, and in a dual spacer, two vertically different-k spacer materials are used in the inner high-k configuration or in the inner low-k configuration. The effect of spacer materials having permittivity in the range of 1 to 22 and different spacer lengths in single and dual spacer configurations has been extensively studied in terms of analog and RF behavior. The high value of the drain current (2.39E-05 A), the high value of Ion/Ioff ratio (2.39E + 09), lower SS (62.4 mV/Dec), lower DIBL (23.01 mV/V), higher gm, lower gds, and higher gain is obtained with high-k (HfO2) spacer making it suitable for analog and digital applications. The capacitance profile of the device is also increased with dielectric permittivity, resulting in low fT and fmax. In dual spacer design, HfO2 as inner spacer gives better analog behavior in terms of better Ioff, Ion/Ioff, SS and DIBL in comparison to SiO2 as inner spacer material. Analog behavior of the device is improved with inner high-k spacer but RF behavior is better for inner low-k spacer.