<p>Laser heating technology as new hyperfine-precision approach which has been widely applied in the micro-machining of the sandwich laminated semiconductor composites (SLSC), where the memory-dependency of the strain and heat transport significantly increases. To accurately predict the micro-scale transient impact response of SLSC subjected to the non-Gaussian laser beam, a new Cattaneo-photo-thermoelastic model is established in this work based on memory-dependent strain and heat transport evolution laws with Atangana-Baleanu and Tempered-Caputo fractional derivatives. This model aims to analyze the influences of memory dependent thermal transport and strain as well as the parameters ratios of inner/outer layer materials on the photo-thermoelastic response and wave propagations in SLSC. The time-domain solutions of the one-dimensional multi-variables partial differential equations are solved via semi-analytical technique based on Laplace transformation. Dimensionless numerical results reveal that the decrease of the memory-dependent parameters of heat transport and strain lower the thermal wave propagation speed and reduce harmful stress and deformation in the SLSC. And the properly selecting parameters of laser intensity, pulse duration and semiconductor parameters ratios maximally improve the photo-thermo-mechanical impact responses and photo-thermal waves.</p>