Green Etching Technologies: Reducing NO2Emissions while Enhancing Solar Cell Efficiency in Industrial Silicon Wafer Etching
摘要
Multi-crystalline Silicon (mc-Si) wafer’s surface texturing can increase solar cell’s conversion efficiency by lowering incident light reflectance. In this work, the optical characteristics of mc-Si wafers are enhanced through acid texturization. The major aim of this study is to reduce NO2 emissions. Instead of HNO3, we employed a combination of HF and H2O2, which are less hazardous chemical acids. This work highlights the benefits of using less hazardous and more affordable chemicals. Etching was carried out using a variety of chemical acids in different ratios. We prepared a 0.1 M solution of KMnO4 and used in HF: H2O2:KMnO4 in a 3:2:1 ratio. The outcomes of the 60-s etching process were compared with those of raw wafers. Optical microscopy, scanning electron microscope (SEM), UV–visible reflectance and lifetime measurements were used to examine the etched mc-Si wafer. The presence of H2O2 reduces the pollution and enhances the utilization of incident photons in solar cell applications.
Graphical Abstract