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<p>We proposed a pioneering mechanical design and control system for a 5-DOF manipulator dedicated to use with the medium energy ion scattering (MEIS) device, marking the world’s first system capable of measuring the film thickness and composition profile of a 300 mm wafer. While the MEIS device emits the ion beam, the 300 mm wafer can be positioned and rotated at a predefined location, aligning with the path of the ion beam through the proposed manipulator. The proposed 5-DOF manipulator consists of P-R-R-R-R joints, with a kinematic structure advantageous for horizontal orientation tasks involving roll and yaw motions. Forward kinematics, inverse kinematics, and capability map in task space are derived for the proposed manipulator. The manipulator encounters time-varying nonlinearities due to operating in a vacuum condition with high temperatures. To address this challenge, we implemented a time-delay estimation technique in the task space for the manipulator. We have successfully tested the manipulator in a demonstration of handling the 300 mm wafer.</p>

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Design and Control of a 5-DOF Manipulator for Medium Energy Ion Scattering Measuring a 300 mm Wafer

  • 期刊论文

  • 发表日期：

    2025年2月5日

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  • Junyoung Lee,
  • Byeonggi Yu,
  • Kyu-Sang Yu,
  • Wansup Kim,
  • Murim Kim

摘要

We proposed a pioneering mechanical design and control system for a 5-DOF manipulator dedicated to use with the medium energy ion scattering (MEIS) device, marking the world’s first system capable of measuring the film thickness and composition profile of a 300 mm wafer. While the MEIS device emits the ion beam, the 300 mm wafer can be positioned and rotated at a predefined location, aligning with the path of the ion beam through the proposed manipulator. The proposed 5-DOF manipulator consists of P-R-R-R-R joints, with a kinematic structure advantageous for horizontal orientation tasks involving roll and yaw motions. Forward kinematics, inverse kinematics, and capability map in task space are derived for the proposed manipulator. The manipulator encounters time-varying nonlinearities due to operating in a vacuum condition with high temperatures. To address this challenge, we implemented a time-delay estimation technique in the task space for the manipulator. We have successfully tested the manipulator in a demonstration of handling the 300 mm wafer.