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<p>As a pivotal process in MEMS packaging, anodic bonding faces mounting challenges in efficiency, gas entrapment suppression, thermal stress management, and adaptability to specialized structures under the trend of miniaturization and higher integration. This paper comprehensively reviews technological advancements over the past three decades: conventional electric field-driven methods have achieved enhanced process stability through optimized system integration, electrode design, and heating strategies, while auxiliary techniques such as ultrasonic, plasma, and laser-assisted bonding have enabled breakthroughs in low-temperature bonding and material compatibility via mechanisms including mechanical vibration, surface activation, and localized heating. The current landscape is characterized by diversified approaches, each demonstrating specific advantages in particular scenarios, yet common issues persist regarding process uniformity, parameter optimization, and cost-effectiveness. Future research should prioritize exploring multi-field synergy mechanisms, developing intelligent process control systems, and innovating equipment integration solutions to facilitate broader adoption of anodic bonding in MEMS packaging.</p>

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Current Research Status of Micro-Electro-Mechanical Systems (MEMS) Packaging Process Equipment

  • 期刊论文

  • 发表日期：

    2026年4月7日

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  • Juanjuan Gao,
  • Jiahua Xia,
  • Yu Lu,
  • Jiale Zhao,
  • Fusheng Liang,
  • Zhao Wang,
  • Yue Yang,
  • Cheng Fan,
  • Tao Chen

摘要

As a pivotal process in MEMS packaging, anodic bonding faces mounting challenges in efficiency, gas entrapment suppression, thermal stress management, and adaptability to specialized structures under the trend of miniaturization and higher integration. This paper comprehensively reviews technological advancements over the past three decades: conventional electric field-driven methods have achieved enhanced process stability through optimized system integration, electrode design, and heating strategies, while auxiliary techniques such as ultrasonic, plasma, and laser-assisted bonding have enabled breakthroughs in low-temperature bonding and material compatibility via mechanisms including mechanical vibration, surface activation, and localized heating. The current landscape is characterized by diversified approaches, each demonstrating specific advantages in particular scenarios, yet common issues persist regarding process uniformity, parameter optimization, and cost-effectiveness. Future research should prioritize exploring multi-field synergy mechanisms, developing intelligent process control systems, and innovating equipment integration solutions to facilitate broader adoption of anodic bonding in MEMS packaging.