<p>Probe testing is performed on all chips during the manufacturing process to ensure quality control in semiconductor. To enhance productivity in semiconductor manufacturing, it is essential to minimize contamination and wear of the probe tip during the testing process. In this work, the tribological and contact resistance characteristics of microelectromechanical system-type probe tips were assessed. On the counter surface, aluminum (Al) coating used for the contact pads of semiconductor chips and polishing sheets used for cleaning the probe tips were used. Based on the analysis of wear particle generation and contact behavior, a new design for the probe tip was proposed. Specifically, micro-bumps were designed on the tip surface to distribute the contact load for minimization of Al particle generation and reducing contact resistance by increasing the contact area for a given applied load. The effectiveness of the newly proposed tip design was verified through finite element method analysis.</p>