<p>Transient liquid phase (TLP) bonding technology was effectively used to join a Ni-based superalloy using a BNi-2 amorphous interlayer. The TLP joint consisted of isothermal solidification zone (ISZ) with γ + γ′ phase and diffusion affected zone (DAZ) with granular borides. A post weld heat treatment (PWHT) process was subsequently employed to homogenize the joint microstructure and reduce the compositional fluctuation. Creep tests conducted under 800 ℃ and 120&#xa0;MPa revealed that both the TLP and TLP + PWHT samples exhibited similar γ′ phase shearing deformation modes and intergranular fracture characteristics. Through PWHT process, the small ISZ grains were eliminated and the oxidation resistance of the joint was enhanced, reducing the cracking tendency of the joint grain boundaries. Therefore, the creep life of the TLP bonded sample is significantly prolonged from 367&#xa0;h to 1034&#xa0;h after PWHT process.</p> Graphical Abstract <p></p>

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Effect of Post Weld Heat Treatment on Microstructure and Creep Property of the TLP Bonded Ni-Based Superalloy

  • Jie Chen,
  • Minghao Hu,
  • Chong Li,
  • Huijun Li,
  • Xingchuan Xia

摘要

Transient liquid phase (TLP) bonding technology was effectively used to join a Ni-based superalloy using a BNi-2 amorphous interlayer. The TLP joint consisted of isothermal solidification zone (ISZ) with γ + γ′ phase and diffusion affected zone (DAZ) with granular borides. A post weld heat treatment (PWHT) process was subsequently employed to homogenize the joint microstructure and reduce the compositional fluctuation. Creep tests conducted under 800 ℃ and 120 MPa revealed that both the TLP and TLP + PWHT samples exhibited similar γ′ phase shearing deformation modes and intergranular fracture characteristics. Through PWHT process, the small ISZ grains were eliminated and the oxidation resistance of the joint was enhanced, reducing the cracking tendency of the joint grain boundaries. Therefore, the creep life of the TLP bonded sample is significantly prolonged from 367 h to 1034 h after PWHT process.

Graphical Abstract