Scholarlink

<p>Brazing of aluminum alloys using chemically active fillers is in demand in transportation and aerospace engineering for the development of new techniques suitable under microgravity conditions for outer space repair. This work presents a theoretical study of diffusion and hydrodynamic flows in molten Zn solder during the reactive wetting of an Al–Mg-Mn plate under various gravity conditions. The model is developed in the isothermal formulation at different wetting temperatures, considering the concentration-driven effect in the soldered zone. The influence of Marangoni convection caused by the Zn concentration gradient on the flow structure and erosion of the base material is analyzed. The effect of zinc evaporation during reactive wetting under vacuum conditions is revealed and quantitatively described. The dependency of the Zn solder droplet radius during its spreading on a flat Al–Mg-Mn plate under various external conditions is also analyzed.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Concentration-Induced Convection in Reactive Wetting of Al–Mg-Mn Alloys by Zn-based Solders under Variable Gravity

  • 期刊论文

  • 发表日期：

    2026年3月7日

查看全文
  • Svetlana A. Gruzd,
  • Ilya R. Saltykov,
  • Ilya V. Shutov,
  • Dmitry S. Samsonov,
  • Mikhail D. Krivilyov

摘要

Brazing of aluminum alloys using chemically active fillers is in demand in transportation and aerospace engineering for the development of new techniques suitable under microgravity conditions for outer space repair. This work presents a theoretical study of diffusion and hydrodynamic flows in molten Zn solder during the reactive wetting of an Al–Mg-Mn plate under various gravity conditions. The model is developed in the isothermal formulation at different wetting temperatures, considering the concentration-driven effect in the soldered zone. The influence of Marangoni convection caused by the Zn concentration gradient on the flow structure and erosion of the base material is analyzed. The effect of zinc evaporation during reactive wetting under vacuum conditions is revealed and quantitatively described. The dependency of the Zn solder droplet radius during its spreading on a flat Al–Mg-Mn plate under various external conditions is also analyzed.