<p>To overcome the limited operating temperature range and poor environmental adaptability of conventional epoxy-based pressure sensor packaging, a glass frit sintering process is investigated as an alternative encapsulation approach. The glass frit packaging process, including frit coating, pre-sintering, and bonding sintering, is systematically studied. An orthogonal experimental design is employed to evaluate the effects of peak temperature, holding time, and bonding pressure on the packaging strength of pressure sensor chips during bonding sintering. Environmental adaptability tests, including operational shock, short-duration high-level vibration, and thermal shock, are conducted to assess the reliability of the bonded interfaces. The results indicate that the influence of the processing parameters on packaging strength follows the order of peak temperature, holding time, and bonding pressure. The optimal sintering parameters are determined to be a peak temperature of 445 °C, a holding time of 35 min, and a bonding pressure of 500 mbar. Under these conditions, the maximum shear strength of approximately 34 kgf is achieved, representing an improvement of about 210 % compared with epoxy-based packaging. Furthermore, full-temperature-range tests from −55 °C to 300 °C demonstrate that glass frit-packaged pressure sensors maintain stable linear output and an overall accuracy better than 0.3 %FS. The operating temperature range is extended by approximately 150 °C relative to epoxy-packaged sensors, highlighting the suitability of glass frit packaging for high-temperature and harsh-environment pressure sensor applications.</p>