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<p>Underfill materials can enhance board-level reliability; however, their physical properties—particularly the glass-transition temperature (Tg)—significantly affect performance. This study addressed this limitation by evaluating the effect of underfills on the thermal fatigue reliability of ball grid array (BGA) packages in automotive electronics via experiments and finite element analysis. Four conditions were tested: non-underfilled and underfilled with high (151 °C), medium (134 °C), and low (89 °C) Tg materials. Thermal shock cycling ranged from −40 °C to 150 °C with 10 min dwells. Solder joint failure was assessed via real-time resistance monitoring. Scanning electron microscopy and electron backscatter diffraction (EBSD) were used to examine microstructural changes. The results showed that the high-Tg underfill yielded the longest lifespan (2248 cycles), followed by the medium-Tg, non-underfilled, and low-Tg conditions. EBSD showed that the underfills enhanced recrystallization and reduced stress concentration. These findings support optimal underfill selection for improving long-term BGA reliability in automotive applications.</p>

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Impact of underfill materials on the thermal shock reliability of BGA packages in automotive electronics

  • 期刊论文

  • 发表日期：

    2026年5月12日

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  • Jeeyeon Park,
  • Dajung Kim,
  • Hyunseung Yang,
  • Do Seop Kim,
  • Cheol Hwan Jeon,
  • Jae Cheol Bae,
  • Dong Jun Kim,
  • Chulmin Oh

摘要

Underfill materials can enhance board-level reliability; however, their physical properties—particularly the glass-transition temperature (Tg)—significantly affect performance. This study addressed this limitation by evaluating the effect of underfills on the thermal fatigue reliability of ball grid array (BGA) packages in automotive electronics via experiments and finite element analysis. Four conditions were tested: non-underfilled and underfilled with high (151 °C), medium (134 °C), and low (89 °C) Tg materials. Thermal shock cycling ranged from −40 °C to 150 °C with 10 min dwells. Solder joint failure was assessed via real-time resistance monitoring. Scanning electron microscopy and electron backscatter diffraction (EBSD) were used to examine microstructural changes. The results showed that the high-Tg underfill yielded the longest lifespan (2248 cycles), followed by the medium-Tg, non-underfilled, and low-Tg conditions. EBSD showed that the underfills enhanced recrystallization and reduced stress concentration. These findings support optimal underfill selection for improving long-term BGA reliability in automotive applications.