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<p>In this paper, an advanced metal-patterning technology that improves flexibility in circuit design and manufacturability while maintaining the electrical properties of electrical traces is reported. Despite its electrical advantages, traditional electroplating is limited by certain materials and environmental issues. Direct laser sintering (DLS), which sinters metal particles using a laser, offers precise patterning and is cost-efficient. Therefore, we prepared a low-temperature Ag-coated Cu paste containing Bi and Sn particles to reduce the sintering temperature and prevent oxidation. In addition, a femtosecond laser was employed for sintering by optimizing the energy absorption to minimize plastic substrate damage. The absorption rate of the metal paste from the ultraviolet to the infrared region was determined to select the best wavelength for laser sintering. Sintering at a 22 mm defocusing height was also performed to obtain optimal electrical properties with a specific resistance of 0.29 mΩ·cm. This process successfully powered an LED at low voltage and current, demonstrating the potential of DLS technology as an alternative to conventional plating methods. This study highlights the feasibility of low-temperature sintering using femtosecond lasers for high-performance electrical trace manufacturing, offering environmental and cost benefits.</p>

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Fabrication method for electrically conductive patterns on a plastic substrate via direct laser sintering

  • 期刊论文

  • 发表日期：

    2025年5月6日

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  • Jeong Heon Lee,
  • Jae B. Kwak

摘要

In this paper, an advanced metal-patterning technology that improves flexibility in circuit design and manufacturability while maintaining the electrical properties of electrical traces is reported. Despite its electrical advantages, traditional electroplating is limited by certain materials and environmental issues. Direct laser sintering (DLS), which sinters metal particles using a laser, offers precise patterning and is cost-efficient. Therefore, we prepared a low-temperature Ag-coated Cu paste containing Bi and Sn particles to reduce the sintering temperature and prevent oxidation. In addition, a femtosecond laser was employed for sintering by optimizing the energy absorption to minimize plastic substrate damage. The absorption rate of the metal paste from the ultraviolet to the infrared region was determined to select the best wavelength for laser sintering. Sintering at a 22 mm defocusing height was also performed to obtain optimal electrical properties with a specific resistance of 0.29 mΩ·cm. This process successfully powered an LED at low voltage and current, demonstrating the potential of DLS technology as an alternative to conventional plating methods. This study highlights the feasibility of low-temperature sintering using femtosecond lasers for high-performance electrical trace manufacturing, offering environmental and cost benefits.