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<p>Diamond wire saw is the main tool for cutting silicon wafers, and the residual tensile stress on the surface of high-carbon steel wire will make the wire saw easy to break when cutting. In this paper, the thermal-ultrasonic vibration stress relief method was used to treat the high-carbon steel wire, and the evolution of its residual stress, mechanical properties and microstructure was studied. The results show that when the heat treatment temperature is 723 K, the residual stress on the surface of the high-carbon steel wire changes from +56 MPa to −34 MPa, and after superimposed ultrasonic vibration, the residual stress becomes −46 MPa. The thermal-ultrasonic vibration stress relief method can not only inhibit the grain growth of the material caused by heat treatment, but also reduce the yield stress of the material and improve the effect of ultrasonic vibration stress relief.</p>

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Optimizing mechanical properties of diamond wire saw busbar with thermal-ultrasonic stress relief method

  • 期刊论文

  • 发表日期：

    2025年5月7日

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  • Miao Zhang,
  • Shujuan Li,
  • Tuo Kang,
  • Feilong Liu,
  • Zhen Jia,
  • Wang Qin,
  • Weipei Zhang,
  • Lie Liang

摘要

Diamond wire saw is the main tool for cutting silicon wafers, and the residual tensile stress on the surface of high-carbon steel wire will make the wire saw easy to break when cutting. In this paper, the thermal-ultrasonic vibration stress relief method was used to treat the high-carbon steel wire, and the evolution of its residual stress, mechanical properties and microstructure was studied. The results show that when the heat treatment temperature is 723 K, the residual stress on the surface of the high-carbon steel wire changes from +56 MPa to −34 MPa, and after superimposed ultrasonic vibration, the residual stress becomes −46 MPa. The thermal-ultrasonic vibration stress relief method can not only inhibit the grain growth of the material caused by heat treatment, but also reduce the yield stress of the material and improve the effect of ultrasonic vibration stress relief.