Effect of residual stress on adhesion behaviour of TiN coating
摘要
TiN coating prepared by physical vapour deposition on additively manufactured Ti-6Al-4V alloy was studied from the perspective of residual stress to improve adhesion strength. The growth mechanism of TiN coatings was analysed and the coating adhesions were evaluated using a scratch tester. The results showed that the crystal nucleus grew under the surface diffusion and grain boundary migration to form a continuous coating. The preferred directions for crystal growth were the (111), (200) and (220) planes. The compressive stress value has a negative correlation with the bonding strength between the coating and the substrate. Specimen with larger tensile stresses had a more regular cross-section and more compact connection, and protected the coating integrity.