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<p>In this study, a UV-curable copper (Cu) paste with enhanced anti-oxidation properties was developed by incorporating polyvinylpyrrolidone (PVP) as a coating agent. The paste was screen-printed and subjected to intense pulsed light (IPL) sintering, a rapid and ambient-temperature processing technique. The PVP-coated Cu electrodes exhibited a specific resistivity of 12&#xa0;µΩ·cm after three sintering cycles, along with a thermal conductivity of 60.87&#xa0;W/m·K. This combination of low resistivity and high thermal conductivity underscores the potential for efficient thermal management in electronic applications. To further improve durability and oxidation resistance, anti-corrosion agents, including organic solderability preservative (OSP) and oleic acid, were applied. Lifetime testing under room temperature and high-humidity conditions (85&#xa0;°C/85% RH) revealed that while all samples maintained stable resistance in ambient conditions, only the OSP-treated electrodes sustained performance under harsh environments, remaining stable for over 120&#xa0;h. These findings suggest that the integration of UV-curable PVP-coated Cu paste with IPL sintering offers a cost-effective and efficient approach to fabricating durable conductive patterns on heat-sensitive substrates, particularly when combined with OSP treatment for enhanced durability in challenging environments.</p>

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Enhanced durability and conductivity of UV-curable PVP-coated copper electrodes via IPL sintering for electronic applications

  • 期刊论文

  • 发表日期：

    2025年5月7日

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  • Hyun Jin Nam,
  • Wan-Geun Lee,
  • Sang Hoon Jung,
  • Se-Hoon Park,
  • Jong-Hyun Lee

摘要

In this study, a UV-curable copper (Cu) paste with enhanced anti-oxidation properties was developed by incorporating polyvinylpyrrolidone (PVP) as a coating agent. The paste was screen-printed and subjected to intense pulsed light (IPL) sintering, a rapid and ambient-temperature processing technique. The PVP-coated Cu electrodes exhibited a specific resistivity of 12 µΩ·cm after three sintering cycles, along with a thermal conductivity of 60.87 W/m·K. This combination of low resistivity and high thermal conductivity underscores the potential for efficient thermal management in electronic applications. To further improve durability and oxidation resistance, anti-corrosion agents, including organic solderability preservative (OSP) and oleic acid, were applied. Lifetime testing under room temperature and high-humidity conditions (85 °C/85% RH) revealed that while all samples maintained stable resistance in ambient conditions, only the OSP-treated electrodes sustained performance under harsh environments, remaining stable for over 120 h. These findings suggest that the integration of UV-curable PVP-coated Cu paste with IPL sintering offers a cost-effective and efficient approach to fabricating durable conductive patterns on heat-sensitive substrates, particularly when combined with OSP treatment for enhanced durability in challenging environments.