Scholarlink

<p>This study systematically analyzed the influence laws and mechanisms of heat treatment and pulsed current treatment on the interfacial bonding performance of TA1/2A12 Ti/Al composite plates prepared by rolling, and the regulatory effects of different process parameters and processing times on the performance of the composite plates have been clarified. Through heat treatment at 500°C for 2&#xa0;h, the bonding strength was increased to 43.9%, reaching 126.8&#xa0;MPa; while pulse current treatment at 157.2 A/mm<sup>2</sup> for 12&#xa0;min resulted in a 54% increase, with a peak of 135.7&#xa0;MPa. While current density was 175.2 A/mm<sup>2</sup>, pulse current treatment can more rapidly and efficiently enhance the bonding performance of composite plates. Quantitative analysis demonstrates that pulse current treatment can significantly reduce the atomic diffusion activation energy due to the non-thermal effect of the pulsed current, and its efficiency in promoting element diffusion far exceeds that of heat treatment. The study reveals the mechanism by which thermal and pulse current treatments affect the performance of composite plates by regulating element diffusion and interfacial reactions, providing a theoretical basis and process reference for the efficient preparation and performance optimization of Ti/Al composite plates.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Mechanism of Pulsed Current Treatment in Regulating Microstructure Evolution and Interfacial Bonding Properties of Rolled Ti/Al Composite Sheets

  • 期刊论文

  • 发表日期：

    2026年5月28日

查看全文
  • Yizhi Zhang,
  • Litao Gao,
  • Junxin Wei,
  • Wei Zhang,
  • Xinxin Liu,
  • Yi Jia,
  • Shouzhen Cao,
  • Jianchao Han

摘要

This study systematically analyzed the influence laws and mechanisms of heat treatment and pulsed current treatment on the interfacial bonding performance of TA1/2A12 Ti/Al composite plates prepared by rolling, and the regulatory effects of different process parameters and processing times on the performance of the composite plates have been clarified. Through heat treatment at 500°C for 2 h, the bonding strength was increased to 43.9%, reaching 126.8 MPa; while pulse current treatment at 157.2 A/mm2 for 12 min resulted in a 54% increase, with a peak of 135.7 MPa. While current density was 175.2 A/mm2, pulse current treatment can more rapidly and efficiently enhance the bonding performance of composite plates. Quantitative analysis demonstrates that pulse current treatment can significantly reduce the atomic diffusion activation energy due to the non-thermal effect of the pulsed current, and its efficiency in promoting element diffusion far exceeds that of heat treatment. The study reveals the mechanism by which thermal and pulse current treatments affect the performance of composite plates by regulating element diffusion and interfacial reactions, providing a theoretical basis and process reference for the efficient preparation and performance optimization of Ti/Al composite plates.