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<p>Existing 6xxx series Al alloys for laser additive manufacturing face challenges in achieving high reliability, due to persistent cracking, porosity, and insufficient surface quality. Their potential for high thermal conductivity and other key properties in aerospace environments also remains underdeveloped. This study introduces an interlayer pause (IP) strategy to address these issues. We systematically investigate how IP duration affects the density, microstructure, and thermal conductivity of laser powder bed fusion (LPBF) AA6061, and the results show that an optimal IP time is crucial, enabling an as-deposited density of 99.21% and a thermal conductivity of 175.1 W/(m&#xa0;K). The improvement is attributed to reduced defects and a weakened solidification texture, which lower electron scattering and extend the mean free path. Post-T6 heat treatment further increases conductivity to 205.5 W/(m&#xa0;K). This work elucidates the mechanism by which IP regulates melt pool history to optimize microstructure and performance, providing a foundation for fabricating high-performance Al heat-dissipation components via LPBF.</p>

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Design Interlayer Pause for Eliminating Cracking and Improving Thermal Conductivity of LPBF AA6061

  • 期刊论文

  • 发表日期：

    2026年6月2日

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  • Xu Huang,
  • Kunhan He,
  • Senqiang Chu,
  • Weidong Huang,
  • Shuaishuai Qin

摘要

Existing 6xxx series Al alloys for laser additive manufacturing face challenges in achieving high reliability, due to persistent cracking, porosity, and insufficient surface quality. Their potential for high thermal conductivity and other key properties in aerospace environments also remains underdeveloped. This study introduces an interlayer pause (IP) strategy to address these issues. We systematically investigate how IP duration affects the density, microstructure, and thermal conductivity of laser powder bed fusion (LPBF) AA6061, and the results show that an optimal IP time is crucial, enabling an as-deposited density of 99.21% and a thermal conductivity of 175.1 W/(m K). The improvement is attributed to reduced defects and a weakened solidification texture, which lower electron scattering and extend the mean free path. Post-T6 heat treatment further increases conductivity to 205.5 W/(m K). This work elucidates the mechanism by which IP regulates melt pool history to optimize microstructure and performance, providing a foundation for fabricating high-performance Al heat-dissipation components via LPBF.