Process Parameter Optimization of Ion Beam Polishing for Single-Crystal Germanium Using Grey Relational Analysis
摘要
Single-crystal germanium optics are vital in infrared imaging systems, where ultra-precision machining must balance material removal rate and surface quality. Due to the strong coupling among ion beam polishing parameters, achieving both objectives simultaneously is challenging. This study proposes a multi-objective optimization approach to identify optimal process parameters for improved polishing efficiency and surface quality. A four-factor, four-level orthogonal experiment was designed to study the effects of gas flow, ion beam voltage, acceleration voltage, and RF power on volume removal rate (VRR) and surface roughness (Sq). Range analysis evaluated the influence of each factor. Single-objective optimizations were conducted to maximize VRR and minimize Sq. Then, gray relational analysis was used to establish a multi-objective optimization model, identifying a balanced parameter set. The maximum VRR (35.06 × 10−5 mm3/s) occurred at 4.5 sccm, 1200 V, 300 V, and 60 W. The lowest Sq (0.647 nm) was achieved at 4 sccm, 900 V, 200 V, and 60 W. The comprehensive optimal combination—4.5 sccm, 1200 V, 200 V, and 60 W—effectively balances efficiency and surface quality. This approach provides a reference for optimizing ion beam polishing processes in other materials.