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<p>In this study, a carbide modification technique was employed to enhance the overall performance of sintered Mo-Cu composites. Mo powder mixed with phenolic formaldehyde (PF) was calcined at 900&#xa0;°C to produce Mo powder modified with an Mo<sub>2</sub>C phase. This modified powder was subsequently pressed and infiltrated to form Mo-Cu composites. The properties of all Mo<sub>2</sub>C-modified Mo-Cu composites exhibited significant improvements compared to unmodified counterparts. Notably, composites prepared using Mo powder calcined with 2&#xa0;wt.% PF demonstrated optimal performance, achieving a relative density of 98.9%, a microhardness of 184.2 HV, and an electrical conductivity of 39.2% IACS. The presence of Mo<sub>2</sub>C enhances the wettability between Cu and Mo, facilitating the fabrication of composites with higher Cu phase connectivity and lower porosity. This approach provides a novel perspective for the continued advancement of Mo-Cu composite technologies.</p>

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Simultaneously Improve the Density and Electrical Conductivity of Mo-Cu Composites by Mo2C Modification

  • 期刊论文

  • 发表日期：

    2025年8月28日

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  • Q. Chen,
  • Y. Sun,
  • J. Q. Lai,
  • Y. H. Tian,
  • S. D. Guo,
  • J. B. Zhang

摘要

In this study, a carbide modification technique was employed to enhance the overall performance of sintered Mo-Cu composites. Mo powder mixed with phenolic formaldehyde (PF) was calcined at 900 °C to produce Mo powder modified with an Mo2C phase. This modified powder was subsequently pressed and infiltrated to form Mo-Cu composites. The properties of all Mo2C-modified Mo-Cu composites exhibited significant improvements compared to unmodified counterparts. Notably, composites prepared using Mo powder calcined with 2 wt.% PF demonstrated optimal performance, achieving a relative density of 98.9%, a microhardness of 184.2 HV, and an electrical conductivity of 39.2% IACS. The presence of Mo2C enhances the wettability between Cu and Mo, facilitating the fabrication of composites with higher Cu phase connectivity and lower porosity. This approach provides a novel perspective for the continued advancement of Mo-Cu composite technologies.