Functionalized Boron Nitride Nanoribbons Effectively Enhance the Mechanical and Thermal Conductivity of Epoxy Resin
摘要
Epoxy resin (EP) is a widely used polymer matrix for electronic insulation due to its excellent electrical properties. However, its inherently low thermal conductivity can lead to heat accumulation in high-power devices, potentially compromising performance and lifespan. To address this issue, we report here the development of novel modified one-dimensional boron nitride nanoribbons (BNNBs) as thermally conductive fillers for EP composites. 3-Aminopropyltriethoxysilane (APTES) and isopropyl tri (dioctyl pyrophosphate) titanate (NDZ-201) were used to enhance the dispersion and interface compatibility of functional BNNBs in EP to improve the mechanical and thermal conductivity of EP. The results indicate that, when APTES is used as a modifier, the overall performance of the composite is optimal. When the filler content of BNNBs is 2 wt.%, the tensile strength of APTES BNNBs/EP (A-BNNBs/EP) composite reaches 59.4 MPa, which is 58.40% higher than BNNBs/EP composite and 84.73% higher than the EP. Moreover, when the filler content is 4 wt.%, the thermal conductivity of the A-BNNBs/EP composite reaches 0.42 W m−1 K−1, which is 27.27% higher than the BNNBs/EP composite and 133.3% higher than the EP. Meanwhile, the efficient heat dissipation performance of the A-BNNBs/EP composite has been further demonstrated by infrared testing and finite element analysis. The toughening and heat transfer mechanisms are also discussed and investigated.