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<p>Electro-assisted forming (EAF) can effectively improve the formability of materials. Copper-aluminum laminate composites (Cu-Al LCs) are widely used in various manufacturing industries because of their excellent electrical conductivity and formability. For Cu-Al LCs, the intermetallic compounds (IMC) in the interface zone are the key to determining the synergistic deformation behavior of composites. The effect of pulsed current on the interface zone will directly affect the forming performance of Cu-Al LCs. In this study, a mechanism that can be used to explain the promotion of microcrack healing within composites composed of materials with different melting points by pulsed currents is presented. The effect of the introduction of pulsed current on the behavior of the Cu-Al LCs in terms of recrystallization in the interfacial zone, microcrack healing, crack extension and dislocation motion is discussed in detail. The plasticizing mechanism of pulsed current on Cu-Al LCs is proposed, and then the pulsed current parameters that can both reduce the flow stresses during deformation and improve their ductility in electrically assisted tensile (EAT) tests are obtained.</p>

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The Impact of Pulse Current on the Deformation and Damage Behavior of Cu/Al Layered Composites

  • 期刊论文

  • 发表日期：

    2025年4月10日

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  • Tao Huang,
  • Mu Qiao,
  • Binghui Xing,
  • Siliang Yan,
  • Nan Xiang,
  • Junqing Guo,
  • Liang Huang,
  • Wenjing Zhang

摘要

Electro-assisted forming (EAF) can effectively improve the formability of materials. Copper-aluminum laminate composites (Cu-Al LCs) are widely used in various manufacturing industries because of their excellent electrical conductivity and formability. For Cu-Al LCs, the intermetallic compounds (IMC) in the interface zone are the key to determining the synergistic deformation behavior of composites. The effect of pulsed current on the interface zone will directly affect the forming performance of Cu-Al LCs. In this study, a mechanism that can be used to explain the promotion of microcrack healing within composites composed of materials with different melting points by pulsed currents is presented. The effect of the introduction of pulsed current on the behavior of the Cu-Al LCs in terms of recrystallization in the interfacial zone, microcrack healing, crack extension and dislocation motion is discussed in detail. The plasticizing mechanism of pulsed current on Cu-Al LCs is proposed, and then the pulsed current parameters that can both reduce the flow stresses during deformation and improve their ductility in electrically assisted tensile (EAT) tests are obtained.