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<p>Directly bonded W/Cu plates find important applications in fields such as nuclear fusion reactors. However, the bonding process is difficult because W and Cu do not react nor form solid solutions with each other at any temperatures. In the current work, W/Cu bonded plates without any intermediate layer materials were successfully fabricated by hot pressing. The maximum shear strength of the prepared W/Cu plates was <i>τ</i> = 137.2&#xa0;MPa. A large amount of WO<sub>x</sub> crystal grains (1–2&#xa0;μm in size) were formed in situ on the bonded interface of W plates. The WO<sub>x</sub> grains and W protrusions formed on the W plates were embedded in Cu plates, which was the most important factor contributing to the bonding strength of the W/Cu bonded plates. The shearing and breaking process of the W/Cu bonded plates included three stages: stage I corresponded to the plastic deformation of Cu; stage II mainly included cutting and sliding friction occurring on the bonded interface of Cu; and breaking of W protrusions, debonding of WO<sub>x</sub> grains, and tearing of Cu occurred in stage III.</p>

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New Characteristics and Bonding Mechanisms of the Directly Bonded W/Cu Plates

  • 期刊论文

  • 发表日期：

    2025年3月18日

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  • Pengfei Zhang,
  • Huanju He,
  • Zhansheng Zhang,
  • Biao Wang,
  • Zhengao Li,
  • Tiesong Lin,
  • Zhihua Yang

摘要

Directly bonded W/Cu plates find important applications in fields such as nuclear fusion reactors. However, the bonding process is difficult because W and Cu do not react nor form solid solutions with each other at any temperatures. In the current work, W/Cu bonded plates without any intermediate layer materials were successfully fabricated by hot pressing. The maximum shear strength of the prepared W/Cu plates was τ = 137.2 MPa. A large amount of WOx crystal grains (1–2 μm in size) were formed in situ on the bonded interface of W plates. The WOx grains and W protrusions formed on the W plates were embedded in Cu plates, which was the most important factor contributing to the bonding strength of the W/Cu bonded plates. The shearing and breaking process of the W/Cu bonded plates included three stages: stage I corresponded to the plastic deformation of Cu; stage II mainly included cutting and sliding friction occurring on the bonded interface of Cu; and breaking of W protrusions, debonding of WOx grains, and tearing of Cu occurred in stage III.