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<p>This study investigates the properties of two Sn-Ag alloys with distinct compositional modifications. The Sn4Ag3Bi0.05Ni (SABN) alloy was engineered to enhance the reliability of solder joints in automotive electronics under extreme conditions. The addition of Bi improves mechanical properties by forming a solid solution with Sn, while the incorporation of Ni modifies the interfacial intermetallic compound (IMC) morphology, resulting in a smoother structure that reduces roughness by 48% compared to SAC305 (Sn3Ag0.5Cu). These modifications effectively reduce the IMC growth rate and enhance the adhesive strength at the solder–IMC interface. Thermal cycling tests showed that the SABN alloy achieved three times (326%) more late-failed cycles than SAC305, revealing that the substitution of Cu with Ni significantly enhances thermal fatigue resistance and reliability. These results demonstrate that the SABN alloy represents a significant advancement in solder material technology, offering improved durability and mechanical performance tailored to the stringent demands of the automotive industry.</p>

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Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy

  • 期刊论文

  • 发表日期：

    2025年3月6日

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  • Wei-Ting Lin,
  • Kelvin Li,
  • Kuo-Shu Lin,
  • Chang-Meng Wang,
  • Albert T. Wu

摘要

This study investigates the properties of two Sn-Ag alloys with distinct compositional modifications. The Sn4Ag3Bi0.05Ni (SABN) alloy was engineered to enhance the reliability of solder joints in automotive electronics under extreme conditions. The addition of Bi improves mechanical properties by forming a solid solution with Sn, while the incorporation of Ni modifies the interfacial intermetallic compound (IMC) morphology, resulting in a smoother structure that reduces roughness by 48% compared to SAC305 (Sn3Ag0.5Cu). These modifications effectively reduce the IMC growth rate and enhance the adhesive strength at the solder–IMC interface. Thermal cycling tests showed that the SABN alloy achieved three times (326%) more late-failed cycles than SAC305, revealing that the substitution of Cu with Ni significantly enhances thermal fatigue resistance and reliability. These results demonstrate that the SABN alloy represents a significant advancement in solder material technology, offering improved durability and mechanical performance tailored to the stringent demands of the automotive industry.