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<p>The FeCoNiCrMn high-entropy alloy (HEA) system, regarded as a potential advanced diffusion barrier, was studied for its soldering reactions and interfacial stability with Sn-based solders across a temperature range of 250–700°C. Initially, the reactions exhibited uneven dissolution of the HEA substrate. During the Sn/HEA reactions between 250°C and 500°C, the (Fe,Cr,Co)Sn<sub>2</sub> phase predominantly formed with a slow growth rate. Even after 48&#xa0;h at 250°C, the interface remained stable. The (Fe,Cr,Co)Sn<sub>2</sub> phase displayed two sublayers with slightly different contrasts and microstructures, suggesting different formation mechanisms. The sublayer near the HEA was dense, with higher Cr and lower Co content, formed via Sn diffusion. The other sublayer, closer to the solder, contained faceted grains that formed through HEA dissolution and precipitation. Oversaturated precipitation also resulted in the formation of large (Co,Ni)Sn<sub>3</sub> grains. Additionally, when using Sn-3wt.%Ag-0.5wt.%Cu (SAC305) and Sn-0.5wt.%Cu solders, the sizes of the faceted (Fe,Cr,Co)Sn<sub>2</sub> grains were significantly reduced. At 700°C, significant microstructural changes occurred due to severe dissolution. The dominant reaction phase shifted to (Fe,Cr,Co)Sn, and a CrSn<sub>2</sub>-solder mixture was confined to the original interface. The FeCoNiCrMn alloy demonstrated good wettability, sluggish (Fe,Cr,Co)Sn<sub>2</sub> growth, and stable interfaces without phase spalling.</p>

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Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures

  • 期刊论文

  • 发表日期：

    2025年2月18日

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  • Chao-hong Wang,
  • Yue-han Li

摘要

The FeCoNiCrMn high-entropy alloy (HEA) system, regarded as a potential advanced diffusion barrier, was studied for its soldering reactions and interfacial stability with Sn-based solders across a temperature range of 250–700°C. Initially, the reactions exhibited uneven dissolution of the HEA substrate. During the Sn/HEA reactions between 250°C and 500°C, the (Fe,Cr,Co)Sn2 phase predominantly formed with a slow growth rate. Even after 48 h at 250°C, the interface remained stable. The (Fe,Cr,Co)Sn2 phase displayed two sublayers with slightly different contrasts and microstructures, suggesting different formation mechanisms. The sublayer near the HEA was dense, with higher Cr and lower Co content, formed via Sn diffusion. The other sublayer, closer to the solder, contained faceted grains that formed through HEA dissolution and precipitation. Oversaturated precipitation also resulted in the formation of large (Co,Ni)Sn3 grains. Additionally, when using Sn-3wt.%Ag-0.5wt.%Cu (SAC305) and Sn-0.5wt.%Cu solders, the sizes of the faceted (Fe,Cr,Co)Sn2 grains were significantly reduced. At 700°C, significant microstructural changes occurred due to severe dissolution. The dominant reaction phase shifted to (Fe,Cr,Co)Sn, and a CrSn2-solder mixture was confined to the original interface. The FeCoNiCrMn alloy demonstrated good wettability, sluggish (Fe,Cr,Co)Sn2 growth, and stable interfaces without phase spalling.