<p>Expanded graphite–silver (EG–Ag) composites are expected to play an important role as heat dissipation materials for electronic components, which were synthesized via a supercritical CO<sub>2</sub> fluid process (SCFP), enabling uniform dispersion of silver (Ag) particles within the expanded graphite (EG) matrix. AgNO<sub>3</sub> was dissolved in a binary solvent system consisting of either ethanol (EtOH) or methanol (MeOH) diluted with deionized water (DI water), adsorbed onto the EG surface through SCFP, and followed by thermal treatment to form the EG–Ag composites. The effects of reaction time, co-solvent composition, and post thermal treatment on the structural morphology and its thermal properties of EG–Ag composites were investigated. The SCFP showed the performance of improved Ag particle dispersion on EG surface, and yielded the formation of a continuous thermal conduction network on the EG-Ag composites. Optimization of the co-solvent composition and post thermal treatments further enhanced thermal conductivity in both the through-plane and in-plane directions. These results demonstrate that SCFP is a promising method for fabricating EG–Ag composites with high structural integrity and superior thermal dissipation properties, offering great potential for usage in thermal interface materials for high-power electronic and optoelectronic systems.</p>

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Preparation and Thermal Properties of Expanded Graphite-Ag Particle Composites under Supercritical CO2 Process

  • Oh Ruem Lee,
  • Won Gyu Lee

摘要

Expanded graphite–silver (EG–Ag) composites are expected to play an important role as heat dissipation materials for electronic components, which were synthesized via a supercritical CO2 fluid process (SCFP), enabling uniform dispersion of silver (Ag) particles within the expanded graphite (EG) matrix. AgNO3 was dissolved in a binary solvent system consisting of either ethanol (EtOH) or methanol (MeOH) diluted with deionized water (DI water), adsorbed onto the EG surface through SCFP, and followed by thermal treatment to form the EG–Ag composites. The effects of reaction time, co-solvent composition, and post thermal treatment on the structural morphology and its thermal properties of EG–Ag composites were investigated. The SCFP showed the performance of improved Ag particle dispersion on EG surface, and yielded the formation of a continuous thermal conduction network on the EG-Ag composites. Optimization of the co-solvent composition and post thermal treatments further enhanced thermal conductivity in both the through-plane and in-plane directions. These results demonstrate that SCFP is a promising method for fabricating EG–Ag composites with high structural integrity and superior thermal dissipation properties, offering great potential for usage in thermal interface materials for high-power electronic and optoelectronic systems.