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<p>This study investigates the development and characterization of sisal fiber reinforced vinyl ester hybrid composites incorporating CuO nanoparticles and 3-APTMS-treated activated biocarbon derived from banyan leaves. The biocarbon was produced via controlled thermal conversion and chemically modified to enhance interfacial compatibility and dispersion within the polymer matrix. The fabricated composites were evaluated for their mechanical, dielectric, electromagnetic interference (EMI) shielding, and thermal properties. The results demonstrated that hybrid reinforcement significantly improved load transfer efficiency, interfacial polarization, and conductive network formation, leading to enhanced composite performance. Fractographic analysis revealed improved fiber–matrix interfacial bonding with reduced fiber pull-out and matrix cracking in the hybrid composites compared with the neat vinyl ester system. Among all formulations, the composite with the optimized filler loading exhibited superior mechanical strength, enhanced dielectric response, improved thermal stability, and maximum EMI shielding effectiveness, demonstrating its potential for advanced electronic and structural applications.</p>

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Activated biochar and CuO reinforced sisal fiber–vinyl ester composites with enhanced mechanical, thermal, EMI shielding, and dielectric properties

  • 期刊论文

  • 发表日期：

    2026年7月31日

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  • Ravindra Pratap Singh,
  • S. K. Sankar,
  • Sorabh Sharma,
  • Sudhanshu Dev,
  • M. Sreenivasa Reddy,
  • S. Pugazhendhi,
  • V. Mohanavel

摘要

This study investigates the development and characterization of sisal fiber reinforced vinyl ester hybrid composites incorporating CuO nanoparticles and 3-APTMS-treated activated biocarbon derived from banyan leaves. The biocarbon was produced via controlled thermal conversion and chemically modified to enhance interfacial compatibility and dispersion within the polymer matrix. The fabricated composites were evaluated for their mechanical, dielectric, electromagnetic interference (EMI) shielding, and thermal properties. The results demonstrated that hybrid reinforcement significantly improved load transfer efficiency, interfacial polarization, and conductive network formation, leading to enhanced composite performance. Fractographic analysis revealed improved fiber–matrix interfacial bonding with reduced fiber pull-out and matrix cracking in the hybrid composites compared with the neat vinyl ester system. Among all formulations, the composite with the optimized filler loading exhibited superior mechanical strength, enhanced dielectric response, improved thermal stability, and maximum EMI shielding effectiveness, demonstrating its potential for advanced electronic and structural applications.