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<p>Solder joint serves as metallurgical interconnection that ensuring both mechanical integrity and electrical functionality of electronic components. Solder joint reliability is essential to maintain the performance and lifespan of electronic components. Among various failure modes, crack formation within solder joints is a primary indicator of failure. However, detecting and analyzing cracks poses significant challenges, especially for components with many solder joints, such as in ball grid array (BGA) packages. This study aims to evaluate the effectiveness of a crack severity approach in predicting solder joint reliability for mirrored flip chip BGA (FCBGA) package mounted on different printed circuit boards (PCBs) thicknesses of 1.2&#xa0;mm, 1.6&#xa0;mm, and 2.0&#xa0;mm. The FCBGA package was subjected to thermal cycling testing (TCT) ranging from 400 cycles up to 1200 cycles. Post-testing, the packages underwent dye and pull tests to map crack locations and quantify dye penetration percentages, providing a measure of crack severity. The results revealed that the thinnest PCB (1.2&#xa0;mm) exhibited the highest cumulative crack severity at 6.52%, followed by the 1.6&#xa0;mm PCB at 3.93%, and the thickest PCB (2.0&#xa0;mm) showing the lowest crack severity of 2.17%. This indicates that thicker PCBs enhance solder joint reliability by reducing crack formation. Across all PCB thicknesses and TCT, bottom-side components consistently showed higher crack severity than topside components. Additionally, solder joints in the outermost rows (A and H) had the most severe cracks, while the inner rows (B to G) showed lower crack severity. In summary, this study provides valuable insights into the use of crack severity analysis as a practical and effective method for assessing solder joint reliability in mirrored FCBGA packages. It highlights the significant impact of PCB thickness, component placement, and solder ball position on crack development, offering guidance for improving electronic packaging reliability in industry applications.</p>

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Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages

  • 期刊论文

  • 发表日期：

    2025年8月14日

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  • Muhammad Nizam Ilias,
  • Maria Abu Bakar,
  • Azman Jalar,
  • Adlil Aizat Ismail,
  • Erwan Basiron,
  • Sai Song Low

摘要

Solder joint serves as metallurgical interconnection that ensuring both mechanical integrity and electrical functionality of electronic components. Solder joint reliability is essential to maintain the performance and lifespan of electronic components. Among various failure modes, crack formation within solder joints is a primary indicator of failure. However, detecting and analyzing cracks poses significant challenges, especially for components with many solder joints, such as in ball grid array (BGA) packages. This study aims to evaluate the effectiveness of a crack severity approach in predicting solder joint reliability for mirrored flip chip BGA (FCBGA) package mounted on different printed circuit boards (PCBs) thicknesses of 1.2 mm, 1.6 mm, and 2.0 mm. The FCBGA package was subjected to thermal cycling testing (TCT) ranging from 400 cycles up to 1200 cycles. Post-testing, the packages underwent dye and pull tests to map crack locations and quantify dye penetration percentages, providing a measure of crack severity. The results revealed that the thinnest PCB (1.2 mm) exhibited the highest cumulative crack severity at 6.52%, followed by the 1.6 mm PCB at 3.93%, and the thickest PCB (2.0 mm) showing the lowest crack severity of 2.17%. This indicates that thicker PCBs enhance solder joint reliability by reducing crack formation. Across all PCB thicknesses and TCT, bottom-side components consistently showed higher crack severity than topside components. Additionally, solder joints in the outermost rows (A and H) had the most severe cracks, while the inner rows (B to G) showed lower crack severity. In summary, this study provides valuable insights into the use of crack severity analysis as a practical and effective method for assessing solder joint reliability in mirrored FCBGA packages. It highlights the significant impact of PCB thickness, component placement, and solder ball position on crack development, offering guidance for improving electronic packaging reliability in industry applications.