<p>Numerical simulations have been&#xa0;extensively used to study particles impacting behaviors in cold spray. However, existing simulation methods commonly neglect the consideration of adhesion, thus not able to correctly capture the particle rebounding-deposition competition. In this study, an interfacial adhesion model was incorporated into the peridynamics framework to enable quantitative evaluation of particle–substrate adhesion in cold spray. Focusing on copper (Cu) as the representative material, the effects of impact velocity, spray angle, and preheating temperature were systematically investigated. The rebound-to-bonding transition was observed beyond the critical deposition threshold, associated with increased contact area and adhesion that counteract elastic rebound energy, thereby allowing the determination of the critical velocity and spray angle. Furthermore, simulation results show that the critical velocity decreases approximately linearly with increasing preheating temperature due to enhanced thermal softening. These findings are consistent with experimental observations reported in the literature, indicating that the peridynamics simulation approach provides a comprehensive and realistic description of the impact and adhesion behaviors during the cold spray coating build-up process.</p>